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  AM-8705 Datasheet PDF File

For AM-8705 Found Datasheets File :: 87+       Page :: | 1 | 2 | 3 | <4> | 5 | 6 | 7 | 8 | 9 |   

   
Part No. TDA8705ATD-T
Description Analog-to-Digital Converter6-Bit

File Size 446.41K  /  13 Page

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Amphenol Communications Solutions

Part No. 87052-106HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 6 Positions, 2.54 mm Pitch, Vertical, 19.56 mm (0.77 in.) Mating, 3.05 mm (0.12 in.) Tail.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0554870519 55487-0519

Molex Electronics Ltd.
Part No. 0554870519 55487-0519
Description 2.00mm (.079) Pitch Wire-to-Board Header, Vertical, Shrouded, High Wall Type, withInner Positive Lock, Lead-free, 5 Circuits
2.00mm (.079") Pitch Wire-to-Board Header, Vertical, Shrouded, High Wall Type, withInner Positive Lock, Lead-free, 5 Circuits

File Size 195.32K  /  4 Page

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Amphenol Communications Solutions

Part No. 87052-130HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 30 Positions, 2.54 mm Pitch, Vertical, 19.56 mm (0.77 in.) Mating, 3.05 mm (0.12 in.) Tail.
Tech specs    

Official Product Page

    8705171200

Meder Electronic
Part No. 8705171200
Description MRX05-1A71

File Size 91.33K  /  2 Page

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Amphenol Communications Solutions

Part No. 87052-150HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 50 Positions, 2.54 mm Pitch, Vertical, 19.56 mm (0.77 in.) Mating, 3.05 mm (0.12 in.) Tail.
Tech specs    

Official Product Page

    Motorola Mobility Holdings, Inc.
Part No. MC68705P5S
Description 8-BIT, UVPROM, 2.1 MHz, MICROCONTROLLER, CDIP28 CERDIP-28

File Size 670.20K  /  18 Page

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Amphenol Communications Solutions

Part No. 87052-170HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 70 Positions, 2.54 mm Pitch, Vertical, 19.56 mm (0.77 in.) Mating, 3.05 mm (0.12 in.) Tail.
Tech specs    

Official Product Page

    0513870530 51387-0530

Molex Electronics Ltd.
Part No. 0513870530 51387-0530
Description USB On-The-Go (OTG) Mini-B Receptacle, Right Angle, Short Body, SMT Solder Tailsand Through Hole Shell Tabs, with Cover Tape, Reflow DIP Type, Lead-free

File Size 204.70K  /  5 Page

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Amphenol Communications Solutions

Part No. 87052-418HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 18 Positions, 2.54 mm Pitch, Vertical, 19.56 mm (0.77 in.) Mating, 3.05 mm (0.12 in.) Tail.
Tech specs    

Official Product Page

   
Part No. MC68705U3S
Description 8-BIT, OTPROM, 2.1 MHz, MICROCONTROLLER, CDIP40 8-BIT, OTPROM, 2.1 MHz, MICROCONTROLLER, CDIP40

File Size 681.58K  /  18 Page

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Amphenol Communications Solutions

Part No. 87052-438HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 38 Positions, 2.54 mm Pitch, Vertical, 19.56 mm (0.77 in.) Mating, 3.05 mm (0.12 in.) Tail.
Tech specs    

Official Product Page

    MCP8705012

Microchip Technology
Part No. MCP8705012
Description High-Speed N-Channel Power MOSFET

File Size 675.21K  /  16 Page

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Amphenol Communications Solutions

Part No. 87052-458HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 58 Positions, 2.54 mm Pitch, Vertical, 19.56 mm (0.77 in.) Mating, 3.05 mm (0.12 in.) Tail.
Tech specs    

Official Product Page

    MCP8705512

Microchip Technology
Part No. MCP8705512
Description High-Speed N-Channel Power MOSFET

File Size 581.10K  /  16 Page

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Amphenol Communications Solutions

Part No. 87052-116HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 16 Positions, 2.54 mm Pitch, Vertical, 19.56 mm (0.77 in.) Mating, 3.05 mm (0.12 in.) Tail.
Tech specs    

Official Product Page

    8705174335

Meder Electronic
Part No. 8705174335
Description    Reed Relay

File Size 72.32K  /  2 Page

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Amphenol Communications Solutions

Part No. 87052-138HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 38 Positions, 2.54 mm Pitch, Vertical, 19.56 mm (0.77 in.) Mating, 3.05 mm (0.12 in.) Tail.
Tech specs    

Official Product Page

    2SC5096FT EE08705

Toshiba, Corp.
TOSHIBA[Toshiba Semiconductor]
Part No. 2SC5096FT EE08705
Description NPN EPITAXIAL PLANAR TYPE (VHF~UHF BAND LOW NOISE AMPLIFIER APPLICATIONS) 瑞展型(甚高超高频波段低噪声放大器应用)
From old datasheet system

File Size 81.96K  /  1 Page

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Amphenol Communications Solutions

Part No. 87052-158HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 58 Positions, 2.54 mm Pitch, Vertical, 19.56 mm (0.77 in.) Mating, 3.05 mm (0.12 in.) Tail.
Tech specs    

Official Product Page

For AM-8705 Found Datasheets File :: 87+       Page :: | 1 | 2 | 3 | <4> | 5 | 6 | 7 | 8 | 9 |   

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