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Powerex Power Semicondu...
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Part No. |
QID1215003
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OCR Text |
...isolated from the heat sinking baseplate, offering simplified system assembly and thermal management. features: lo w e sw(off) alumin um nitride isolation discrete super-fast recovery free-wheel silicon carbide schottky diod... |
Description |
Hybrid IGBT Module
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File Size |
519.80K /
7 Page |
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it Online |
Download Datasheet |
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Powerex Power Semicondu...
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Part No. |
QID1210007
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OCR Text |
...isolated from the heat sinking baseplate, offering simplified system assembly and thermal management. features: lo w e sw(off) alumin um nitride isolation discrete super-fast recovery free-wheel silicon carbide schottky diod... |
Description |
Split Dual Si/SiC
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File Size |
518.90K /
7 Page |
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it Online |
Download Datasheet |
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Powerex Power Semicondu...
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Part No. |
QID0640020
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OCR Text |
...isolated from the heat sinking baseplate, offering simplified system assembly and thermal management. features: alsic baseplate low drive power low v ce(sat) discrete super-fast recovery free-wheel diode isolated base... |
Description |
Dual IGBTMOD NX-Series Module 400 Amperes/600 Volts
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File Size |
575.75K /
5 Page |
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it Online |
Download Datasheet |
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SynQor Worldwide Headqu...
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Part No. |
PQ60150HZW40XYZ-G
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OCR Text |
...not exceed 6in-lb. (0.7 nm). 2) baseplate flatness tolerance is 0.004" (.10 mm) tir for surface. 3) pins 1-4, 6-8, and b are 0.040 (1.02mm) diameter, with 0.080 (2.03mm) diameter standoff shoulders. 4) pins 5 and 9 are 0.080 (2.03 mm) di... |
Description |
Industry standard half-brick pin-out configuration
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File Size |
2,818.11K /
16 Page |
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it Online |
Download Datasheet |
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Price and Availability
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