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bonding Datasheet PDF File

For bonding Found Datasheets File :: 7119 Search Time::0.922ms
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				Analog Devices, Inc. AD[Analog Devices]
Part No.	AD586 AD586A AD586AR AD586B AD586BR AD586J AD586JCCHIPS AD586JCHIPS AD586JN AD586JQ AD586JR AD586K AD586KN AD586KQ AD586KR AD586L AD586LQ AD586LR AD586M AD586MN AD586S AD586SQ AD586T AD586TQ AD586LN
OCR Text	...n. All areas are covered except bonding pads and scribe lines. Surface Metalization: The metalization to Analog Devices bipolar dice is aluminum. Minimum thickness is 10,000A. bonding Pads: All bonding pads have a minimum size of 4 mils by ...
Description	High Precision 5 V Reference 1-OUTPUT THREE TERM VOLTAGE REFERENCE, 5 V, PDIP8 High Precision 5 V Reference 1-OUTPUT THREE TERM VOLTAGE REFERENCE, 5 V, CDIP8 High Precision 5 V Reference 1-OUTPUT THREE TERM VOLTAGE REFERENCE, 5 V, PDSO8 High Precision 5 V Reference 高精 V参
File Size	196.90K / 8 Page	View it Online	Download Datasheet

				ANALOG DEVICES INC Analog Devices, Inc.
Part No.	AD587 AD587JCHIPS AD587JN AD587JQ AD587JR AD587KN AD587KQ AD587KR AD587LN AD587LQ AD587SQ AD587TQ AD587UQ
OCR Text	... . All areas are covered except bonding pads and scribe lines. Surface Metalization: The metalization to Analog Devices bipolar dice is aluminum. Minimum thickness is 10,000A. bonding Pads: All bonding pads have a minimum size of 4 mils by ...
Description	High Precision 10 V Reference
File Size	115.88K / 8 Page	View it Online	Download Datasheet

				Micrel Semiconductor
Part No.	KSZ9031RNXIC KSZ9031RNXCA KSZ9031RNXCC
OCR Text	... package lead finish wire bonding description ksz9031rnxca 0c to 70c 48- pin qfn pb - free gold rgmii, commercial temperature, gold wire bonding ksz9031rnxcc (1) 0c to 70c 48- pin qfn pb - free copper rgm ii...
Description	Gigabit Ethernet Transceiver with RGMII Support
File Size	1,042.13K / 75 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC634
OCR Text	...e at www.hittite.com mounting & bonding techniques for millimeterwave gaas mmics the die should be attached directly to the ground plane eutectically or with conductive epoxy (see hmc general handling, mounting, bonding note). 50 ohm micro...
Description	GaAs PHEMT MMIC DRIVER AMPLIFIER, 5 - 20 GHz
File Size	288.86K / 8 Page	View it Online	Download Datasheet

				Micrel Semiconductor
Part No.	KSZ8081RNACA KSZ8081RND KSZ8081RND-EVAL KSZ8081RNA-EVAL KSZ8081RNDCA
OCR Text	... package lead finish wire bonding description ksz8081rnaca 0c to 70c 24- pin qfn pb - free gold rmii with 25mhz crystal /clock input and 50mhz rmii ref_clk output (power - up default), commercial temperature, gold wire...
Description	10Base-T/100Base-TX PHY with RMII Support
File Size	715.51K / 51 Page	View it Online	Download Datasheet

				M/A-COM Technology Solutions, Inc.
Part No.	MASW6030G
OCR Text	...ency (ghz) insertion loss wire bonding a. ball or wedge with 1.0 mil diameter pure gold wire. thermosonic wirebonding with a nominal stage temperature of 150c and a ball bonding force of 40 to 50 grams or wedge bonding force o1 18 to...
Description	GaAs DPDT Switch DC - 6.0 GHz
File Size	62.69K / 4 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC51809
OCR Text	...e at www.hittite.com mounting & bonding techniques for millimeterwave gaas mmics the die should be attached directly to the ground plane eutectically or with conductive epoxy (see hmc general handling, mounting, bonding note). 50 ohm mic...
Description	GaAs PHEMT MMIC LOW NOISE AMPLIFIER, 20 - 32 GHz
File Size	257.20K / 6 Page	View it Online	Download Datasheet

For bonding Found Datasheets File :: 7119 Search Time::0.922ms
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