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STMICROELECTRONICS[STMicroelectronics]
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Part No. |
ESDAXXSCX
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OCR Text |
... the routing and contributes to hardening against ESD. 4. ADVICE FOR OPTIMIZING CIRCUIT BOARD LAYOUT Circuit board layout is a critical design step in the suppression of ESD induced transients. The following guidelines are recommended:
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Description |
QUAD TRANSIL ARRAY FOR ESD PROTECTION QUAD TRANSIL⑩ ARRAY FOR ESD PROTECTION
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File Size |
80.75K /
10 Page |
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http:// HIROSE[Hirose Electric] Hirose Electric USA, INC. HIROSE ELECTRIC Co., Ltd.
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Part No. |
FH25-51S-0.3SH FH25-21S-0.3SH FH25-27S-0.3SH FH25-33S-0.3SH FH25-39S-0.3SH FH25-45S-0.3SH
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OCR Text |
...er
1 Polyamide and thermally hardening adhesive is recommended as the stiffener materials. 2 Overlap between covering film layer and stiffener is 0.5mm min.
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0.5MIN
Stiffener
Unit: mm Part Number
FH25-21S-0.3SH(05) FH25-27S... |
Description |
0.3 mm Contact Pitch/ 0.9 mm above the board/ Flexible Printed Circuit ZIF Connectors. MS3108A16-11S 0.3 mm Contact Pitch, 0.9 mm above the board, Flexible Printed Circuit ZIF Connectors. 联系间距0.3毫米0.9以上的电路板,柔性线路板中频连接毫米
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File Size |
479.58K /
8 Page |
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it Online |
Download Datasheet
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Price and Availability
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