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Renesas Electronics Corporation |
Part No. |
R7F7016873AFP-C
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Description |
High-end Automotive Microcontrollers Ideal for Body Applications
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Tech specs |
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Official Product Page
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Renesas Electronics Corporation |
Part No. |
R7F7016874AFP-C#AA1
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Description |
High-end Automotive Microcontrollers Ideal for Body Applications
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Tech specs |
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Official Product Page
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Renesas Electronics Corporation |
Part No. |
R7F7016874AFP-C
|
Description |
High-end Automotive Microcontrollers Ideal for Body Applications
|
Tech specs |
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Official Product Page
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Renesas Electronics Corporation |
Part No. |
R7F7016873AFP-C#AA1
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Description |
High-end Automotive Microcontrollers Ideal for Body Applications
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Tech specs |
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Official Product Page
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Agilent (Hewlett-Packard)
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Part No. |
HDMP-3001 HDMP-3001K
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Description |
Telecommunication IC HDMP-3001K · Evaluation Board for Multi-Protocol IC (MPIC) Ethernet Over SONET/SDH (EOS) Mapper HDMP-3001 · Multi-Protocol IC (MPIC) Ethernet Over SONET/SDH (EOS) Mapper: Fast Ethernet to OC-3
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File Size |
51.13K /
2 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
Part No. |
91687-326LF
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Description |
Dubox®2.54mm, Board to Board Connector, Shrouded Header, Double Row, Straight.
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Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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JITONG
TECHNOLOGY
(CHINA HK & SZ)
Datasheet.hk's Sponsor |
Part: HDMP-1687 |
Maker: AGILENT |
Pack: BGA |
Stock: Reserved |
Unit price
for : |
50: $18.12 |
100: $17.21 |
1000:
$16.30 |
Email: oulindz@gmail.com |
Contact us |
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