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  HDMP-2634 Datasheet PDF File

For HDMP-2634 Found Datasheets File :: 128+       Page :: | 1 | 2 | 3 | <4> | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 |   

    Agilent (Hewlett-Packard)
Part No. HDMP-0452
Description HDMP-0452 · 1.0625-1.25 GBd Quad Port Bypass Circuit with CDR for Fibre Channel/Storage and GbE Applications

File Size 272.00K  /  12 Page

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Amphenol Communications Solutions

Part No. 10142634-309KLF
Description Minitek MicroSpace™ 1.27mm Crimp-to-Wire Connector Platform, Wire to Board Connector, Horizontal, Header, Surface Mount, 9 Position<br><br>(For product qualification latest status, please submit <a href=\\javascript:;\\ class=\\button product-enquiry\\ style=\\background: none;color: red;\\><span>Product Enquiry</span></a>)
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HUA FENG CIRCUIT





    Agilent (Hewlett-Packard)
Part No. HDMP-0450
Description HDMP-0450 · 1.0625-1.25 GBd Quad Port Bypass Circuit with Signal Detect for FC/Storage and GbE Applications

File Size 268.47K  /  10 Page

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Amphenol Communications Solutions

Part No. 10142634-307KLF
Description Minitek MicroSpace™ 1.27mm Crimp-to-Wire Connector Platform, Wire to Board Connector, Horizontal, Header, Surface Mount, 7 Position<br><br>(For product qualification latest status, please submit <a href=\\javascript:;\\ class=\\button product-enquiry\\ style=\\background: none;color: red;\\><span>Product Enquiry</span></a>)
Tech specs    

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    Agilent (Hewlett-Packard)
Part No. HDMP-0422
Description HDMP-0422 · 1.0625-1.25 GBd Single Port Bypass Circuit wirh CDR & Data Valid Detection for FC/Storage and GbE

File Size 251.28K  /  14 Page

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Part No. 10142634-216KLF
Description Minitek MicroSpace™ 1.50mm Crimp-to-Wire Connector Platform, Wire to Board Connector, Horizontal, Header, Surface Mount, 16 Position,Staggered,side Latch<br><br>(For product qualification latest status, please submit <a href=\\javascript:;\\ class=\\button product-enquiry\\ style=\\background: none;color: red;\\><span>Product Enquiry</span></a>)
Tech specs    

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    Agilent (Hewlett-Packard)
Part No. HDMP-0440
Description Voltage Regulator IC; Output Current:100mA; Output Voltage:6.2V; Package/Case:3-TO-92; Voltage Regulator Type:Positive Voltage; Mounting Type:Through Hole; Supply Voltage:35V
HDMP-0440 · 1.0625-1.25 GBd Quad Port Bypass Circuit without CDR for Fibre Channel/Storage and GbE Applications

File Size 270.40K  /  10 Page

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Amphenol Communications Solutions

Part No. 92634-428HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 28 Positions, 2.54 mm Pitch, Right Angle, 8.08 mm (0.318in) Mating, 8.08 mm (0.318in) Tail.
Tech specs    

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    22634

SCHOTT CORPORATION
Part No. 22634
Description TRANSMIT TRANSFORMER, CEPT 75/120

File Size 17.92K  /  1 Page

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Amphenol Communications Solutions

Part No. 92634-130HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 30 Positions, 2.54 mm Pitch, Right Angle, 8.08 mm (0.318in) Mating, 8.08 mm (0.318in) Tail.
Tech specs    

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    HP[Agilent(Hewlett-Packard)]
Part No. HDMP-1034 HDMP-1032
Description 1.4 GBd Transmitter/Receiver Chip Set with CIMT Encoder/Decoder and Variable Data Rate

File Size 340.14K  /  32 Page

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Amphenol Communications Solutions

Part No. 92634-456HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 56 Positions, 2.54 mm Pitch, Right Angle, 8.08 mm (0.318in) Mating, 8.08 mm (0.318in) Tail.
Tech specs    

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    Agilent (Hewlett-Packard)
Part No. HDMP-1034 HDMP-1032
Description 1.4 GBd Receiver Chip Set with CIMT Encoder/Decoder and Variable Data Rate(带CIMT编码译码器和变量数据速率.4 GBd 接收
1.4 GBd Transmitter Chip Set with CIMT Encoder/Decoder and Variable Data Rate(带CIMT编码译码器和变量数据速率.4 GBd 传送器)
1.4 GBd Transmitter/Receiver Chip Set with CIMT Encoder/Decoder and Variable Data Rate

File Size 344.71K  /  32 Page

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Amphenol Communications Solutions

Part No. 92634-158HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 58 Positions, 2.54 mm Pitch, Right Angle, 8.08 mm (0.318in) Mating, 8.08 mm (0.318in) Tail.
Tech specs    

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    HDMP-1014 HDMP-1012

Agilent(Hewlett-Packard)
Part No. HDMP-1014 HDMP-1012
Description Bipolar Transistor; Collector Emitter Voltage, Vceo:400V; Transistor Polarity:N Channel; Power Dissipation:250W; C-E Breakdown Voltage:400V; DC Current Gain Min (hfe):10; Collector Current:50A; Package/Case:TO-3
Phase Lock Loop (PLL) IC; Number of Circuits:1; Package/Case:14-DIP; Mounting Type:Through Hole 4Low成本千兆速率发接收芯片

File Size 301.59K  /  42 Page

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Amphenol Communications Solutions

Part No. 92634-104HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 4 Positions, 2.54 mm Pitch, Right Angle, 8.08 mm (0.318in) Mating, 8.08 mm (0.318in) Tail.
Tech specs    

Official Product Page

    HDMP-1512 HDMP-1514

Agilent(Hewlett-Packard)
Part No. HDMP-1512 HDMP-1514
Description Fibre Channel Transmitter Chipset(光纤通道传送芯
Fibre Channel Receiver Chipset(光纤通道接收芯片)

File Size 285.72K  /  26 Page

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Amphenol Communications Solutions

Part No. 92634-448HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 48 Positions, 2.54 mm Pitch, Right Angle, 8.08 mm (0.318in) Mating, 8.08 mm (0.318in) Tail.
Tech specs    

Official Product Page

    HDMP-1012 HDMP-1014

Agilent (Hewlett-Packard)
HP[Agilent(Hewlett-Packard)]
Part No. HDMP-1012 HDMP-1014
Description 4Low Cost Gigabit Rate Transmit/Receive Chip Set

File Size 292.88K  /  42 Page

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Amphenol Communications Solutions

Part No. 92634-102HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 2 Positions, 2.54 mm Pitch, Right Angle, 8.08 mm (0.318in) Mating, 8.08 mm (0.318in) Tail.
Tech specs    

Official Product Page

For HDMP-2634 Found Datasheets File :: 128+       Page :: | 1 | 2 | 3 | <4> | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 |   

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