| |
|
 |
Amphenol Communications Solutions |
| Part No. |
G883C015T1EU
|
| Description |
Socket 2.5mm Pitch, CRIPMING TYPE, TERMINAL, MATTE TIN
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
10155516-C015LF
|
| Description |
Minitek MicroSpaceXS™ 1.27mm, Right Angle, Receptacle, Surface mount, 15 position
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
10155504-C015LF
|
| Description |
Minitek MicroSpaceXS™ 1.27mm Crimp-to-Wire Connector Platform, wire-to-board, Receptacle, 15 Position, STG, Top Latch; C Coding<br><br>(For product qualification latest status, please submit <a href=\\javascript:;\\ class=\\button product-enquiry\\ style=\\background: none;color: red;\\><span>Product Enquiry</span></a>)
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
SAMSUNG SEMICONDUCTOR CO. LTD.
|
| Part No. |
KS57C01502 KS57C01504
|
| Description |
The KS57C01502/C01504 single-chip CMOS microcontroller has been designed for high-performance using Samsungs newest 4-bit CPU core, SAM47 (Samsung Arr
|
| File Size |
307.53K /
36 Page |
 View
it Online |
Download Datasheet
|
| |
|
|
HolyStone International
|
| Part No. |
HMC
|
| Description |
Multilayer Ceramic Chip Capacitors for High Temperature Applications
|
| File Size |
243.57K /
3 Page |
View
it Online |
Download Datasheet |
|
Bom2Buy.com
Price and Availability
|
