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MACOM[Tyco Electronics]
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| Part No. |
MA4AGSW2
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| OCR Text |
...Die Attachment
Assembly can be preheated to approximately 125 C. Use a controlled thickness of approximately 2 mils for best electrical and thermal conductivity. Cure epoxy as per manufacturer's schedule. For extended cure times, temperatu... |
| Description |
AlGaAs SP2T PIN Diode Switch
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| File Size |
229.43K /
6 Page |
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it Online |
Download Datasheet
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MACOM[Tyco Electronics]
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| Part No. |
MA4BN1840-1
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| OCR Text |
... Attachment
Assembly should be preheated to 125-150 oC. A minimum amount of epoxy should be used, approximately 1 to 2 mils thickness for best electrical and thermal conductivity. A thin epoxy fillet should be visible around the perimeter ... |
| Description |
Monolithic HMIC Integrated Bias Network 18 - 40 GHz
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| File Size |
178.30K /
9 Page |
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it Online |
Download Datasheet |
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MACOM[Tyco Electronics]
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| Part No. |
MA4BN1840-2
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| OCR Text |
... Attachment
Assembly should be preheated to 125-150 oC. A minimum amount of epoxy should be used, approximately 1 to 2 mils thickness for best electrical and thermal conductivity. A thin epoxy fillet should be visible around the perimeter ... |
| Description |
Monolithic HMIC Integrated Dual Bias Network 18 - 40 GHz
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| File Size |
174.51K /
8 Page |
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it Online |
Download Datasheet |
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MACOM[Tyco Electronics]
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| Part No. |
MA4FCP200
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| OCR Text |
...poxy Die Attach Assembly can be preheated to 125 to 150C. Use a minimum amount of silver epoxy. Cure epoxy as per manufacturer's schedule. For extended cure times, temperatures should be kept below 200C.
Applications
These devices are w... |
| Description |
Silicon Flip Chip PIN Diode
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| File Size |
38.13K /
2 Page |
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it Online |
Download Datasheet |
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MACOM[Tyco Electronics]
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| Part No. |
MA4SW410B-1
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| OCR Text |
... Attachment
Assembly should be preheated to 125-150 C. A Controlled thickness of 2 mils is recommended for best electrical and thermal conductivity. A thin epoxy fillet should be visible around the perimeter of the chip after placement. Cu... |
| Description |
SP4T PIN Diode with Integrated Bias Network
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| File Size |
269.42K /
6 Page |
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it Online |
Download Datasheet |
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MACOM[Tyco Electronics]
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| Part No. |
MA4SW410
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| OCR Text |
... Attachment
Assembly should be preheated to 125-150 oC. A Controlled thickness of 2 mils is recommended for best electrical and thermal conductivity. A thin epoxy fillet should be visible around the perimeter of the chip after placement. C... |
| Description |
SP4T Monolithic PIN Diode Switch
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| File Size |
195.86K /
6 Page |
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it Online |
Download Datasheet |
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MACOM[Tyco Electronics]
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| Part No. |
MA4SW510B-1
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| OCR Text |
...uld be used. Assembly should be preheated to 125-150 oC. A Controlled thickness of 2 mils is recommended for best electrical and thermal conductivity. A thin epoxy fillet should be visible around the perimeter of the chip after placement. C... |
| Description |
SP5T PIN Diode Switch with Integrated Bias Network
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| File Size |
241.68K /
6 Page |
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it Online |
Download Datasheet |
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MACOM[Tyco Electronics]
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| Part No. |
MA4SW610B-1
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| OCR Text |
...uld be used. Assembly should be preheated to 125-150 oC. A Controlled thickness of 2 mils is recommended for best electrical and thermal conductivity. A thin epoxy fillet should be visible around the perimeter of the chip after placement. C... |
| Description |
SP6T PIN Diode Switch with Integrated Bias Network
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| File Size |
244.54K /
6 Page |
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it Online |
Download Datasheet |
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MAXIM[Maxim Integrated Products]
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| Part No. |
MAX2648_1 MAX2648 MAX2648EVKIT
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| OCR Text |
...lace the PC board on a hotplate preheated to about 300C until the IC begins to reflow. Again, use nearby components as a cue. Remove the IC so as not to disturb other components. Remove the PC board from the hotplate-- do not attempt to sol... |
| Description |
From old datasheet system
Evaluation Kit
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| File Size |
168.30K /
5 Page |
View
it Online |
Download Datasheet |
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Price and Availability
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