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NXP Semiconductors N.V.
PHILIPS[Philips Semiconductors]
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| Part No. |
BLW32
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| OCR Text |
...ons are made by means of hollow rivets, whilst under the emitter leads Cu straps are used for a direct contact between upper and lower sheets.
August 1986
8
Philips Semiconductors
Product specification
UHF linear power transi... |
| Description |
UHF linear power transistor(UHF线性功率晶体管) UHF BAND, Si, NPN, RF POWER TRANSISTOR
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| File Size |
81.12K /
12 Page |
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it Online |
Download Datasheet
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Philips
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| Part No. |
BLF548 BLF548_CNV_3
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| OCR Text |
...p
strap
strap
strap
rivets
rivets 70 mm
strap
strap
strap
strap
MBC230
The circuit and components are situated on one side of the PTFE fibre-glass board, the other side being fully metallized to serve as a g... |
| Description |
UHF push-pull power MOS
From old datasheet system
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| File Size |
88.91K /
12 Page |
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it Online |
Download Datasheet |
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PHILIPS[Philips Semiconductors]
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| Part No. |
BLW86
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| OCR Text |
...ons are made by means of hollow rivets, whilst under the emitter leads Cu straps are used for a direct contact between upper and lower sheets. To minimize the dielectric losses, the ground plane under the interconnection of L7 and C7 has be... |
| Description |
HF/VHF power transistor
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| File Size |
116.80K /
15 Page |
View
it Online |
Download Datasheet |
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Price and Availability
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