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SEMTECH[Semtech Corporation] Semtech, Corp.
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| Part No. |
SFC05-4 SFC05-4TM
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| OCR Text |
...e SFC05-4. Solder mask defined (SMD) pads produce stress points near the solder mask on the PCB side that can result in solder joint crackin...laser cut, electro-polished stencil with 0.275mm square apertures and rounded corners is recommended... |
| Description |
CSP TVS Flip Chip TVS Diode Array CSP TVS Flip Chip TVS Diode Array 总警司二极管倒装芯片抑制二极管阵
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| File Size |
172.81K /
7 Page |
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