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  0916 Datasheet PDF File

For 0916 Found Datasheets File :: 100+       Page :: | 1 | 2 | 3 | 4 | <5> | 6 | 7 | 8 | 9 | 10 |   

    0916580050

Molex Electronics Ltd.
Part No. 0916580050
Description track-it, Traceability Pad, Nickel Silver with special processing, -40 to 350C, Plastic

File Size 19.17K  /  1 Page

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Amphenol Communications Solutions

Part No. 54112-109160800LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 16 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0916270001 91627-0001

Molex Electronics Ltd.
Part No. 0916270001 91627-0001
Description 5.00mm (.197) Pitch Appli-Mate? RAST Power IDT Housing
5.00mm (.197") Pitch Appli-Mate垄莽 RAST Power IDT Housing

File Size 601.05K  /  5 Page

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Amphenol Communications Solutions

Part No. 54121-809161550LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 16 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    TCD1503D EA09160 TCD1503

TOSHIBA[Toshiba Semiconductor]
Part No. TCD1503D EA09160 TCD1503
Description From old datasheet system
CCD LINEAR IMAGE SENSOR

File Size 393.61K  /  11 Page

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Amphenol Communications Solutions

Part No. 54122-109161700LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 16 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    Toshiba
Part No. TPCS8205 EA09162
Description From old datasheet system

File Size 283.79K  /  5 Page

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Amphenol Communications Solutions

Part No. 54122-109161850LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 16 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    Toshiba
Part No. TPCS8203 EA09161
Description From old datasheet system

File Size 287.03K  /  5 Page

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Amphenol Communications Solutions

Part No. 54112-109161850LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 16 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0436500916 43650-0916

Molex Electronics Ltd.
Part No. 0436500916 43650-0916
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Single Row, Vertical, with PCB
MOLEX Connector

File Size 153.82K  /  3 Page

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Amphenol Communications Solutions

Part No. 54112-109161700LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 16 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0916190001 91619-0001 SD-91619-001

Molex Electronics Ltd.
Part No. 0916190001 91619-0001 SD-91619-001
Description LaneLink Standoff, M2-by-0.45mm Internal Thread

File Size 87.42K  /  2 Page

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Amphenol Communications Solutions

Part No. 54122-809161400LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 16 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    0916279001 91627-9001 SD-91627-001

Molex Electronics Ltd.
Part No. 0916279001 91627-9001 SD-91627-001
Description 5.00mm (.197) Pitch Appli-Mate RAST Power IDT Housing, Direct/Indirect, Female, 11 Circuits, Glow Wire Compatible
MOLEX Connector

File Size 601.05K  /  5 Page

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Amphenol Communications Solutions

Part No. 54122-109161800LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 16 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    SD-91627-001 0916272501 91627-2501

Molex Electronics Ltd.
Part No. SD-91627-001 0916272501 91627-2501
Description 5.00mm (.197) Pitch Appli-Mate RAST 5 IDT Housing, Direct/Indirect, Female, 4 Circuits
5.00mm (.197") Pitch Appli-Mate RAST 5 IDT Housing, Direct/Indirect, Female, 4 Circuits

File Size 601.39K  /  5 Page

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Amphenol Communications Solutions

Part No. 54122-409161800LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 16 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    52610-2816 52610-2916 52610-0516 52610-0571 52610-0616 52610-0716 52610-0771 52610-0916 52610-0671 52610-0816 52610-0871

Molex Electronics Ltd.
Part No. 52610-2816 52610-2916 52610-0516 52610-0571 52610-0616 52610-0716 52610-0771 52610-0916 52610-0671 52610-0816 52610-0871
Description 1.0 FPC CONN SMT ZIF EMBSTP PKG

File Size 481.08K  /  7 Page

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Amphenol Communications Solutions

Part No. 54121-108091600LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 9 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

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