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  1140-4050 Datasheet PDF File

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    11-40-2036 1140-2036 0011-40-2036

Molex Electronics Ltd.
Part No. 11-40-2036 1140-2036 0011-40-2036
Description Terminator Die

File Size 19.42K  /  1 Page

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Amphenol Communications Solutions

Part No. 1140084168
Description 1140084168-Micro SD Normal Open H=1.55 NONE PUSH
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    11-40-2043 1140-2043 0011-40-2043

Molex Electronics Ltd.
Part No. 11-40-2043 1140-2043 0011-40-2043
Description Terminator Die

File Size 19.42K  /  1 Page

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Amphenol Communications Solutions

Part No. 54111-405051000LF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded vertical stacked header, Through Hole, Single Row, 5 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    1140-4016 0011-40-4016

Molex Electronics Ltd.
Part No. 1140-4016 0011-40-4016
Description Conductor Punch

File Size 11.54K  /  1 Page

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Amphenol Communications Solutions

Part No. 54111-405051250LF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded vertical stacked header, Through Hole, Single Row, 5 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    1140-4009 0011-40-4009

Molex Electronics Ltd.
Part No. 1140-4009 0011-40-4009
Description Insulation Punch

File Size 14.47K  /  1 Page

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Amphenol Communications Solutions

Part No. 54111-405061000LF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded vertical stacked header, Through Hole, Single Row, 6 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    1140-4017 0011-40-4017

Molex Electronics Ltd.
Part No. 1140-4017 0011-40-4017
Description Insulation Punch

File Size 14.44K  /  1 Page

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Amphenol Communications Solutions

Part No. 77311-405-08LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 08 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    1140-4015 0011-40-4015

Molex Electronics Ltd.
Part No. 1140-4015 0011-40-4015
Description Insulation Punch

File Size 14.53K  /  1 Page

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Amphenol Communications Solutions

Part No. 54111-405061250LF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded vertical stacked header, Through Hole, Single Row, 6 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    53358-1140

Molex Electronics Ltd.
Part No. 53358-1140
Description 2.00mm (.049) Pitch Mi II Wire-to-Wire Adapter, 11 Circuits, Lead-free

File Size 130.52K  /  2 Page

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Texas Instruments

Part No. TPS61140DRCR
Description Dual, 2x 27V, 700mA Switch, 1.2MHz Boost Converter with Single Inductor White LED and OLED Driver 10-VSON -40 to 85
Tech specs    

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Official Product Page

    A-70475-1140

Molex Electronics Ltd.
Part No. A-70475-1140
Description
File Size 139.28K  /  2 Page

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Texas Instruments

Part No. M38510/11402BGA
Description JFET Input Operational Amplifiers 8-TO-99 -55 to 125
Tech specs    

Official Product Page

    A-71395-1140

Molex Electronics Ltd.
Part No. A-71395-1140
Description 2.54mm (.100) Pitch C-Grid垄莽 PCB Connector, Surface Mount, High Profile, Dual Row, Vertical, 40 Circuits

File Size 736.43K  /  6 Page

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Texas Instruments

Part No. JM38510/11402BGA
Description JFET Input Operational Amplifiers 8-TO-99 -55 to 125
Tech specs    

Official Product Page

    Molex, Inc.
Part No. 51140-0305
Description 3.96 W/W RETAINER 511400305 INTERCONNECTION DEVICE

File Size 33.77K  /  1 Page

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Texas Instruments

Part No. HPA01140ATPHDRMQ1
Description 4-Channel Automotive Digital Amplifiers 64-HTQFP -40 to 105
Tech specs    

Official Product Page

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