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    International Business Machines, Corp.
Part No. IBM13M32734BCA
Description 32M x 72 2-Bank Registered SDRAM Module(32M x 72 2组寄存同步动态RAM模块) 32M × 72配置2,银行注册内存模块(32M × 72配置2组寄存同步动态内存模块)

File Size 224.46K  /  20 Page

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Amphenol Communications Solutions

Part No. 86094327313765E1LF
Description DIN Headers & Receptacles, Backplane Connector, Header, Right Angle, Through Hole, Style C/2, 32 ways, Class I
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    International Business Machines, Corp.
Part No. IBM13M32734BCB
Description 32M x 72 2-Bank Registered SDRAM Module(32M x 72 2组寄存同步动态RAM模块) 32M × 72配置2,银行注册内存模块(32M × 72配置2组寄存同步动态内存模块)

File Size 196.87K  /  20 Page

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Amphenol Communications Solutions

Part No. 86094327313765ELF
Description DIN Right Angle Header Solder-to-Board Style C/2 32 ways, Class I
Tech specs    

Official Product Page

    IBM Microeletronics
International Business Machines, Corp.
Part No. IBM13M32734BCD
Description 32M x 72 2-Bank Registered/Buffered SDRAM Module(32M x 72 2组寄缓冲同步动态RAM模块) 32M × 72配置2,银行注缓冲内存模组2M × 72配置2组寄缓冲同步动态内存模块)

File Size 200.35K  /  20 Page

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Amphenol Communications Solutions

Part No. UE86K132730321
Description SFP 2X1 WITH LIGHT PIPE
Tech specs    

Official Product Page

    International Business Machines, Corp.
Part No. IBM13Q32734BCA-10Y
Description x72 SDRAM Module
32M x 72 Registered SDRAM Module(32M x 72 200脚寄存同步动态RAM模块) 32M × 72配置注册内存模块2M × 72配置200脚寄存同步动态内存模块)

File Size 112.61K  /  15 Page

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Amphenol Communications Solutions

Part No. 86094327313755E1LF
Description DIN Headers & Receptacles, Backplane Connector, Header, Right Angle, Through Hole, Style C/2, 32 ways, Class II
Tech specs    

Official Product Page

    IBM Microeletronics
Part No. IBM13M32734CCA-360T
Description x72 SDRAM Module
32M x 72 1 Bank Registered/Buffered SDRAM Module(32M x 72 1组寄缓冲同步动态RAM模块)

File Size 160.78K  /  20 Page

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Amphenol Communications Solutions

Part No. 86094327313H55ELF
Description Din Headers and Receptacles, Backplane connectors, Right Angle Header Solder-to-Board Style C/2 32 ways, Class II, with Harpoon
Tech specs    

Official Product Page

   
Part No. IBM13M32734JCA-360T
Description x72 SDRAM Module

File Size 171.90K  /  20 Page

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Amphenol Communications Solutions

Part No. UE86K432730321
Description 2X4 SFP COMBO
Tech specs    

Official Product Page

    IBM Microeletronics
Part No. IBM13M32734CCB IBM13M32734CCB-75AT
Description 32M x 72 1-Bank Registered / Buffered SDRAM Module(32M x 72 1组寄缓冲同步动态RAM模块)
x72 SDRAM Module

File Size 183.29K  /  20 Page

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Amphenol Communications Solutions

Part No. UE86K532730321
Description 2X5 SFP WITH LARGE LP
Tech specs    

Official Product Page

   
Part No. IBM13M32734BCB-75AY
Description x72 SDRAM Module

File Size 1,231.95K  /  20 Page

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Amphenol Communications Solutions

Part No. 86094327313T55F1LF
Description DIN HT HEADER RA STB C/2
Tech specs    

Official Product Page

   
Part No. IBM13M32734BCE-360Y IBM13M32734BCE-260Y
Description x72 SDRAM Module

File Size 1,188.94K  /  21 Page

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Amphenol Communications Solutions

Part No. 86094327313H55E1LF
Description DIN Headers & Receptacles, Backplane Connector, Header, Right Angle, Through Hole, Style C/2, 32 ways, Class II, with Harpoons
Tech specs    

Official Product Page

    IDT[Integrated Device Technology]
Part No. IDT72V73273 IDT72V73273BB IDT72V73273DR
Description 32K x 32K Digital Switch with Rate Matching
32k X 32k TSI, 65 I/Oat 2/4/8/16 or 32Mbps, Rate-Matching, 3.3V
3.3 VOLT TIME SLOT INTERCHANGE DIGITAL SWITCH WITH RATE MATCHING 32,768 X 32,768 CHANNELS

File Size 304.32K  /  37 Page

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Amphenol Communications Solutions

Part No. 86094327313755ELF
Description Din Headers and Receptacles, Backplane connectors, Right Angle Header Solder-to-Board Style C/2 32 ways, Class II, Tail Length: 3mm
Tech specs    

Official Product Page

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