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  3609 Datasheet PDF File

For 3609 Found Datasheets File :: 95+       Page :: | 1 | 2 | 3 | 4 | <5> | 6 | 7 | 8 | 9 | 10 |   

   
Part No. CK3612 CP3612 CP3608 CK3608 CP3610 CG3610 CK3609
Description Analog IC
WEBENCH® Sensor Designer Hi-resolution Differential Sensor I PCB

File Size 107.21K  /  1 Page

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Amphenol Communications Solutions

Part No. 61083-203609LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 200 Positions.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    MILL-MAX MFG CORP
Part No. 0520-0-00-34-3 MILL-MAXMFGCORP-3609-1-07-1-8
Description GOLD FINISH, WIRE TERMINAL

File Size 58.56K  /  1 Page

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Amphenol Communications Solutions

Part No. 54121-107360950LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    K7A403609B06

Samsung semiconductor
Part No. K7A403609B06
Description 128Kx36/x32 & 256Kx18 Synchronous SRAM

File Size 414.82K  /  19 Page

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Amphenol Communications Solutions

Part No. 61083-063609LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 60 Positions.
Tech specs    

Official Product Page

    K7N403609B06

Samsung semiconductor
Part No. K7N403609B06
Description 128Kx36 & 256Kx18 Pipelined NtRAM

File Size 399.79K  /  19 Page

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Amphenol Communications Solutions

Part No. 61082-203609LF
Description BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 200 Positions.
Tech specs    

Official Product Page

    CYRF7936-40LTXC CYRF793609 CYRF7936-40LFXC

Cypress Semiconductor
Part No. CYRF7936-40LTXC CYRF793609 CYRF7936-40LFXC
Description 2.4 GHz CyFi Transceiver

File Size 434.89K  /  21 Page

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Amphenol Communications Solutions

Part No. 61083-183609LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 180 Positions.
Tech specs    

Official Product Page

    CYRF6936-40LTXC CYRF693609 CYRF6936-40LFXC

Cypress Semiconductor
Part No. CYRF6936-40LTXC CYRF693609 CYRF6936-40LFXC
Description WirelessUSB LP 2.4 GHz Radio SoC

File Size 375.14K  /  23 Page

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Amphenol Communications Solutions

Part No. 61083-103609LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 100 Positions.
Tech specs    

Official Product Page

    Samsung Electronic
Part No. K7A803609A K7A801809A
Description 256Kx36Bit Synchronous Pipelined Burst SRAM Data Sheet
512Kx18-Bit Synchronous Pipelined Burst SRAM Data Sheet

File Size 534.84K  /  20 Page

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Amphenol Communications Solutions

Part No. 59202-F36-09A105LF
Description Minitek® 2.00mm, Board To Board, Unshrouded Vertical Header, Surface Mount, Double Row, 18 Positions.
Tech specs    

Official Product Page

    K7N801809B K7N803609B

Samsung semiconductor
Part No. K7N801809B K7N803609B
Description 256Kx36 & 512Kx18 Pipelined NtRAM

File Size 394.30K  /  19 Page

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Amphenol Communications Solutions

Part No. 59112-F36-09-066LF
Description Minitek® 2.00mm, Board To Board, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 18 Positions.
Tech specs    

Official Product Page

    SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. K7A801809A K7A803609A
Description 256Kx36 & 512Kx18 Synchronous SRAM

File Size 366.99K  /  20 Page

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Amphenol Communications Solutions

Part No. 54111-112360900LF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded vertical stacked header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    SAMSUNG[Samsung semiconductor]
Part No. K7A803609A K7A801809A
Description 256Kx36 & 512Kx18 Synchronous SRAM

File Size 363.62K  /  20 Page

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Amphenol Communications Solutions

Part No. 61082-043609LF
Description BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 40 Positions.
Tech specs    

Official Product Page

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