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  39504-0114 Datasheet PDF File

For 39504-0114 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | <5> | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    SCHURTER INC
Part No. 3414.0114.11 3414.0124.22
Description SUPER FAST BLOW ELECTRIC FUSE, 0.75A, 32VDC, 35A (IR), SURFACE MOUNT
FUSE, SMD, USF0402, 5A; Current, fuse rating:5A; Case style:0402; Approval Bodies:CCC; Approval category:UL Recognised; Current, breaking capacity DC:35A; Depth, external:0.4mm; Device marking:T; Flammability rating:UL94V-1; Fuse RoHS Compliant: Yes

File Size 420.13K  /  2 Page

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Amphenol Communications Solutions

Part No. 51939-504LF
Description PwrBlade®, Power Connectors, 6P 16S 3ACP Right Angle Header, Solder To Board
Tech specs    

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HUA FENG CIRCUIT





    90160-0114

Molex Electronics Ltd.
Part No. 90160-0114
Description 2.54mm Pitch C-Grid III Crimp Housing Dual Row, 14 Circuits

File Size 26.44K  /  1 Page

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Amphenol Communications Solutions

Part No. 10114829-10114LF
Description 1.25mm Wire to Board Wafer, Vertical, Through Hole, 14 Positions
Tech specs    

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    70553-0114

Molex Electronics Ltd.
Part No. 70553-0114
Description 2.54mm (.100) Pitch SL Header, Low Profile, Single Row, Right Angle, .120 Pocket, Shrouded, 10 Circuits

File Size 348.18K  /  5 Page

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Amphenol Communications Solutions

Part No. 10114831-10114LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 14 POSITIONS, TIN PLATING
Tech specs    

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    74164-0114

Molex Electronics Ltd.
Part No. 74164-0114
Description 2.54mm (.100) Pitch C-Grid? Receptacle, Right Angle, Through Hole, Dual Row,Shrouded with Pegs High-Temperature, 14 Circuits, Tin (Sn

File Size 392.43K  /  4 Page

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Amphenol Communications Solutions

Part No. 10114828-10114LF
Description 1.25mm Wire to Board Wafer,Vertical, Surface Mount, 14 Positions
Tech specs    

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    70066-0114

Molex Electronics Ltd.
Part No. 70066-0114
Description 2.54mm (.100) Pitch SL?/a> Crimp Housing, Single Row, Version D, Back Ribs, 10 Circuits

File Size 108.56K  /  2 Page

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Amphenol Communications Solutions

Part No. 10114830-10114LF
Description 1.25mm Wire to Board Wafer, Right Angle, Surface Mount, 14 Positions
Tech specs    

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    42376-0114

Molex Electronics Ltd.
Part No. 42376-0114
Description 2.54mm (.100) Pitch KK Header, Breakaway, Right Angle, 9 Circuits, Tin (Sn) Plating

File Size 301.60K  /  12 Page

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Amphenol Communications Solutions

Part No. 10114508-D0J-20DLF
Description XCede® High Speed Backplane Connectors, Left polarizing guide module with key feature.
Tech specs    

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    1-201144-8 1-201144-1 201144-3 201144-5 201144-6 201144-7

Tyco Electronics
Part No. 1-201144-8 1-201144-1 201144-3 201144-5 201144-6 201144-7
Description SOCKET MINIATURE SERIES

File Size 107.38K  /  1 Page

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Amphenol Communications Solutions

Part No. 10114828-10102LF
Description 1.25mm Wire to Board Wafer,Vertical, Surface Mount, 2 Positions
Tech specs    

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    SD-120114-082

Molex Electronics Ltd.
Part No. SD-120114-082
Description Micro-Change Molded Junction Box, Top Mount, 8 Ports, LEDs for PNP sensors, with Mini-Change

File Size 114.78K  /  2 Page

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Amphenol Communications Solutions

Part No. 10114868-L0J-10DLF
Description XCede® High Speed Backplane Connectors, 3 wall left header.
Tech specs    

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    SCHURTER AG
Part No. DD11.0114.1110 DD11.0113.1110
Description DD11 POWER ENTRY MODUL 8/10A, 250VAC, MALE, MAINS POWER CONNECTOR, SOLDER

File Size 532.75K  /  3 Page

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Amphenol Communications Solutions

Part No. 10114508-00J-20DLF
Description XCede® High Speed Backplane Connectors, 2 wall header.
Tech specs    

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    SD-120114-077

Molex Electronics Ltd.
Part No. SD-120114-077
Description Micro-Change Molded Junction Box, Top Mount, 6 Ports, LEDs for PNP sensors, with Integral Mini-Change

File Size 111.91K  /  2 Page

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Amphenol Communications Solutions

Part No. 10114492-008LF
Description HPCE R/A REC 32P24S
Tech specs    

Official Product Page

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