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  571-4281 Datasheet PDF File

For 571-4281 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | <5> | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    44281-0001 44281-0002 44281-0003 44281-0004 44281-0005 44281-0006 44281-0007 44281-0008 44281-0009 44281-0010 44281-0011

Molex Electronics Ltd.
Part No. 44281-0001 44281-0002 44281-0003 44281-0004 44281-0005 44281-0006 44281-0007 44281-0008 44281-0009 44281-0010 44281-0011 44281-0012 44281-0013
Description Mini-Fit Test Plugs
Mini-Fit垄芒 Test Plugs

File Size 55.84K  /  2 Page

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Amphenol Communications Solutions

Part No. 54122-414281400LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 28 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    44428-1605 0444281605

Molex Electronics Ltd.
Part No. 44428-1605 0444281605
Description 3.00mm (.118) Pitch Micro-Fit 3.0 BMI?/a> Header, Surface Mount Compatible, DualRow, Right Angle, without Snap-in Plastic Peg PCB Lock, 16 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
3.00mm (.118) Pitch Micro-Fit 3.0 BMI Header, Surface Mount Compatible, DualRow, Right Angle, without Snap-in Plastic Peg PCB Lock, 16 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 232.70K  /  4 Page

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Amphenol Communications Solutions

Part No. 77428-124LF
Description Metral® , Backplane Connectors, Power Insert, Receptacle, Straight, Crimp to Wire.
Tech specs    

Official Product Page

    0444281802 44428-1802

Molex Electronics Ltd.
Part No. 0444281802 44428-1802
Description 3.00mm (.118) Pitch Micro-Fit 3.0 BMI?/a> Header, Surface Mount Compatible, DualRow, Right Angle, with Snap-in Plastic Peg PCB Lock, 18 Circuits, 0.38μm (15μ) Gold
3.00mm (.118) Pitch Micro-Fit 3.0 BMI Header, Surface Mount Compatible, DualRow, Right Angle, with Snap-in Plastic Peg PCB Lock, 18 Circuits, 0.38μm (15μ) Gold
MOLEX Connector

File Size 232.93K  /  4 Page

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Amphenol Communications Solutions

Part No. 77315-428-18LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 18 Positions 2.54mm (0.100in) Pitch, Right Angle
Tech specs    

Official Product Page

    44428-1606 0444281606

Molex Electronics Ltd.
Part No. 44428-1606 0444281606
Description 3.00mm (.118) Pitch Micro-Fit 3.0 BMI?/a> Header, Surface Mount Compatible, Dual Row, Right Angle, without Snap-in Plastic Peg PCB Lock, 16 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
3.00mm (.118) Pitch Micro-Fit 3.0 BMI Header, Surface Mount Compatible, Dual Row, Right Angle, without Snap-in Plastic Peg PCB Lock, 16 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 232.70K  /  4 Page

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Amphenol Communications Solutions

Part No. 77315-428-16LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 16 Positions 2.54mm (0.100in) Pitch, Right Angle
Tech specs    

Official Product Page

    44428-1603 0444281603

Molex Electronics Ltd.
Part No. 44428-1603 0444281603
Description 3.00mm (.118) Pitch Micro-Fit 3.0 BMI?/a> Header, Surface Mount Compatible, Dual Row, Right Angle, with Snap-in Plastic Peg PCB Lock, 16 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
3.00mm (.118) Pitch Micro-Fit 3.0 BMI Header, Surface Mount Compatible, Dual Row, Right Angle, with Snap-in Plastic Peg PCB Lock, 16 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 232.70K  /  4 Page

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Amphenol Communications Solutions

Part No. 54122-428121250LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 12 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    0444281003 44428-1003

Molex Electronics Ltd.
Part No. 0444281003 44428-1003
Description 3.00mm (.118) Pitch Micro-Fit 3.0 BMI Header, Surface Mount Compatible, Dual Row, Right Angle, with Snap-in Plastic Peg PCB Lock, 10 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 232.75K  /  4 Page

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Amphenol Communications Solutions

Part No. 54242-811162350LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 16 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0444281001 44428-1001

Molex Electronics Ltd.
Part No. 0444281001 44428-1001
Description 3.00mm (.118) Pitch Micro-Fit 3.0 BMI Header, Surface Mount Compatible, Dual Row, Right Angle, with Snap-in Plastic Peg PCB Lock, 10 Circuits, Tin (Sn) Plating

File Size 232.70K  /  4 Page

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Amphenol Communications Solutions

Part No. 54242-810202050LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 20 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    44428-1601 0444281601

Molex Electronics Ltd.
Part No. 44428-1601 0444281601
Description 3.00mm (.118) Pitch Micro-Fit 3.0 BMI?/a> Header, Surface Mount Compatible, Dual Row, Right Angle, with Snap-in Plastic Peg PCB Lock, 16 Circuits, Tin (Sn) Plating
3.00mm (.118) Pitch Micro-Fit 3.0 BMI Header, Surface Mount Compatible, Dual Row, Right Angle, with Snap-in Plastic Peg PCB Lock, 16 Circuits, Tin (Sn) Plating

File Size 232.70K  /  4 Page

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Amphenol Communications Solutions

Part No. 54242-810162050LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 16 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    44428-1602 0444281602

Molex Electronics Ltd.
Part No. 44428-1602 0444281602
Description 3.00mm (.118) Pitch Micro-Fit 3.0 BMI Header, Surface Mount Compatible, Dual Row, Right Angle, with Snap-in

File Size 232.75K  /  4 Page

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Amphenol Communications Solutions

Part No. 54242-812081900LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87914-2815 0879142815

Molex Electronics Ltd.
Part No. 87914-2815 0879142815
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75μm (30μ) Gold (Au) Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75渭m (30渭) Gold (Au) Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75楼矛m (30楼矛) Gold (Au) Plating, Tray Packaging, Lead-free

File Size 3,777.37K  /  48 Page

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Amphenol Communications Solutions

Part No. 77428-145LF
Description Metral® , Backplane Connectors, Power Insert, Receptacle, Straight, Crimp to Wire.
Tech specs    

Official Product Page

For 571-4281 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | <5> | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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