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Amphenol Communications Solutions |
Part No. |
54122-808641400LF
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Description |
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 64 position, 2.54mm (0.100in) pitch
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
54122-108641400LF
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Description |
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 64 position, 2.54mm (0.100in) pitch
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
0713086470
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Description |
2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 70 Circuits 1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30mm (.130) 2.54mm (.100") Pitch C-Grid垄莽 Header, Surface Mount, Dual Row, Vertical, 70 Circuits 1.50楼矛m (59楼矛") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30
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File Size |
1,475.71K /
8 Page |
View
it Online |
Download Datasheet |
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Bom2Buy.com
Price and Availability
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