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  71851-0226 Datasheet PDF File

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    220226FD

SUYIN USA, INC.
Part No. 220226FD
Description 2.0mm SOCKET CENTRONIC TYPE

File Size 110.74K  /  1 Page

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Amphenol Communications Solutions

Part No. 87185-127HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 27 Positions, 2.54 mm Pitch, Vertical, 26.49 mm (1.043in) Mating, 2.41 mm (0.095in) Tail.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    TE Connectivity Ltd
Part No. 55PC0226
Description    This specification sheet forms a part of the latest issue of Raychem Specification 55PC.

File Size 20.19K  /  1 Page

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Amphenol Communications Solutions

Part No. 87185-104HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 4 Positions, 2.54 mm Pitch, Vertical, 26.49 mm (1.043in) Mating, 2.41 mm (0.095in) Tail.
Tech specs    

Official Product Page

    XF0226S3

XFMRS Inc.
Part No. XF0226S3
Description Surface Mount Inductor

File Size 40.44K  /  1 Page

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Amphenol Communications Solutions

Part No. 87185-116HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 16 Positions, 2.54 mm Pitch, Vertical, 26.49 mm (1.043in) Mating, 2.41 mm (0.095in) Tail.
Tech specs    

Official Product Page

    PANASONIC[Panasonic Semiconductor]
Matsshita / Panasonic
Part No. MAZL120D 0226
Description Silicon planer type
From old datasheet system
Zener Diodes Composite Elements

File Size 26.26K  /  2 Page

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Amphenol Communications Solutions

Part No. 87185-133HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 33 Positions, 2.54 mm Pitch, Vertical, 26.49 mm (1.043in) Mating, 2.41 mm (0.095in) Tail.
Tech specs    

Official Product Page

   
Part No. 180222D 180226F
Description KONTAKTSTIFT TERMINAL PIN 1.02 Inhalt pro Packung: 1000 Stk.
KONTAKTSTIFT MINI WRAP TERMINAL 1S Inhalt pro Packung: 500 Stk.

File Size 107.95K  /  1 Page

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Amphenol Communications Solutions

Part No. 87185-134HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 34 Positions, 2.54 mm Pitch, Vertical, 26.49 mm (1.043in) Mating, 2.41 mm (0.095in) Tail.
Tech specs    

Official Product Page

    EPCOS AG
Part No. B82792-C0336-N365 B82792-C0226-N365
Description 0.1 A, TELECOM FILTER
0.2 A, TELECOM FILTER

File Size 56.64K  /  1 Page

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Amphenol Communications Solutions

Part No. 87185-120HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 20 Positions, 2.54 mm Pitch, Vertical, 26.49 mm (1.043in) Mating, 2.41 mm (0.095in) Tail.
Tech specs    

Official Product Page

    Zarlink
Part No. ZL30226 ZL30228 ZL30227
Description 4/8/16 Port IMA/TC PHY Device for xDSL

File Size 1,044.14K  /  143 Page

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Amphenol Communications Solutions

Part No. 87185-102HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 2 Positions, 2.54 mm Pitch, Vertical, 26.49 mm (1.043in) Mating, 2.41 mm (0.095in) Tail.
Tech specs    

Official Product Page

    ZARLINK[Zarlink Semiconductor Inc]
Part No. ZL30228_GA ZL30226 ZL30226_GA ZL30227 ZL30227_GA ZL30228
Description 4/8/16 Port IMA/TC PHY Device for xDSL

File Size 735.36K  /  141 Page

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Amphenol Communications Solutions

Part No. 87185-113HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 13 Positions, 2.54 mm Pitch, Vertical, 26.49 mm (1.043in) Mating, 2.41 mm (0.095in) Tail.
Tech specs    

Official Product Page

    Zarlink Semiconductor Inc.
Zarlink Semiconductor I...
Part No. ZL30228/GA ZL30226/GA ZL30227/GA
Description 4/8/16 Port IMA/TC PHY Device for xDSL

File Size 790.16K  /  141 Page

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Amphenol Communications Solutions

Part No. 87185-111HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 11 Positions, 2.54 mm Pitch, Vertical, 26.49 mm (1.043in) Mating, 2.41 mm (0.095in) Tail.
Tech specs    

Official Product Page

    UPD780226

NEC
Part No. UPD780226
Description MOS INTERGRATED CIRCUIT

File Size 1,753.92K  /  47 Page

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Amphenol Communications Solutions

Part No. 87185-118HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 18 Positions, 2.54 mm Pitch, Vertical, 26.49 mm (1.043in) Mating, 2.41 mm (0.095in) Tail.
Tech specs    

Official Product Page

For 71851-0226 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | <5> | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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