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  8116 Datasheet PDF File

For 8116 Found Datasheets File :: 101+       Page :: | 1 | 2 | 3 | 4 | <5> | 6 | 7 | 8 | 9 | 10 | 11 |   

    30968-1167 0309681167

Molex Electronics Ltd.
Part No. 30968-1167 0309681167
Description 2.54mm (.100) Pitch, 0.64mm (.025) Width H-DAC 64?/a> High Density AutomotiveCrimp Housing, Dual Row, 16 Circuits, Polarization Option #1, Gray
2.54mm (.100) Pitch, 0.64mm (.025) Width H-DAC 64 High Density AutomotiveCrimp Housing, Dual Row, 16 Circuits, Polarization Option #1, Gray

File Size 300.97K  /  3 Page

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Amphenol Communications Solutions

Part No. 69168-116HLF
Description PV® Wire-to-Board Connector System, 2 Wall Shrouded Header - Through Hole - Double row - 16 Positions 2.54mm - Vertical.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0309681169 30968-1169

Molex Electronics Ltd.
Part No. 0309681169 30968-1169
Description 2.54mm (.100) Pitch, 0.64mm (.025) Width H-DAC 64

File Size 300.97K  /  3 Page

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Amphenol Communications Solutions

Part No. 68498-116HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 16 Positions, 2.54 mm Pitch, Right Angle, 5.84 mm (0.23 in.) Mating, 5.59 mm (0.22 in.) Tail
Tech specs    

Official Product Page

    30968-1168 0309681168

Molex Electronics Ltd.
Part No. 30968-1168 0309681168
Description 2.54mm (.100) Pitch, 0.64mm (.025) Width H-DAC 64?/a> High Density AutomotiveCrimp Housing, Dual Row, 16 Circuits, Polarization Option #2, Black
2.54mm (.100) Pitch, 0.64mm (.025) Width H-DAC 64 High Density AutomotiveCrimp Housing, Dual Row, 16 Circuits, Polarization Option #2, Black

File Size 300.97K  /  3 Page

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Amphenol Communications Solutions

Part No. 76308-116
Description Dubox® 2.54mm, Board to Board Connector, 16 Positions,Single Row,Vertical,2.54mm pitch,Card Connector.
Tech specs    

Official Product Page

    Fujitsu Limited
Part No. MB8116165B-50 MB8116165B-60
Description 1 M ×16 BIT Hyper Page Mode Dynamic RAM(CMOS 1 M ×16位超级页面存取模式动态RAM)
1 M ?16 BIT Hyper Page Mode Dynamic RAM(CMOS 1 M ?16浣??绾ч〉?㈠???ā寮????AM)

File Size 354.99K  /  29 Page

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Amphenol Communications Solutions

Part No. 68481-164HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Double Row, 64 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0314081160 31408-1160 SD-31408-900

Molex Electronics Ltd.
Part No. 0314081160 31408-1160 SD-31408-900
Description USCAR 2.54mm (.100? Pitch Receptacle
USCAR 2.54mm (.100隆卤) Pitch Receptacle
MOLEX Connector

File Size 423.35K  /  4 Page

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Amphenol Communications Solutions

Part No. RJE724881161
Description Modular Jack - High Performance, Input Output Connectors 8P8C, Shield, With LEDs.
Tech specs    

Official Product Page

    FUJITSU LTD
Part No. MB8116400B-60PJ
Description 4M X 4 FAST PAGE DRAM, 60 ns, PDSO24

File Size 1,054.62K  /  27 Page

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Amphenol Communications Solutions

Part No. 10143578-116KLF
Description Minitek MicroSpace™ 1.27mm Crimp-to-Wire Connector Platform, Wire to Board Connector, Vertical, Header, Surface Mount, 16 Position,staggered,side Latch<br><br>(For product qualification latest status, please submit <a href=\\javascript:;\\ class=\\button product-enquiry\\ style=\\background: none;color: red;\\><span>Product Enquiry</span></a>)
Tech specs    

Official Product Page

    5566-16A 39-28-1163 0039281163

Molex Electronics Ltd.
Part No. 5566-16A 39-28-1163 0039281163
Description 4.20mm (.165") Pitch Mini-Fit Jr.??/a>
4.20mm (.165) Pitch Mini-Fit Jr.

File Size 500.20K  /  6 Page

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Amphenol Communications Solutions

Part No. 78938-116HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 16 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    SAA8116HL SAA8116ET

NXP Semiconductors
Part No. SAA8116HL SAA8116ET
Description Digital PC-camera signal processor including microcontroller and USB interface

File Size 238.77K  /  60 Page

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Amphenol Communications Solutions

Part No. 75168-116-20LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled header, Through Hole, Single Row, 20 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    AY58116 AY58116T_P005 AY58136_P005 AY58136_P006 AY58116_P005 AY58116_P006 AY58116T AY58116T_P006 AY58136 AY58136T AY5813

Microchip Technology Inc.
Part No. AY58116 AY58116T_P005 AY58136_P005 AY58136_P006 AY58116_P005 AY58116_P006 AY58116T AY58116T_P006 AY58136 AY58136T AY58136T_P005 AY58136T_P006 AY58136/P006 AY58116T/P005 AY58136/P005 AY58116/P005 AY58116T/P006 AY58116/P006 AY58136T/P006 AY58136T/P005
Description Dual Baud Rate Generator

File Size 443.35K  /  8 Page

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Amphenol Communications Solutions

Part No. 54122-811640800LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 64 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    Microsemi
Part No. UZ8119 UZ8110 UZ8111 UZ8113 UZ8112 UZ8114 UZ8116 UZ8117 UZ8118
Description POWER ZENERS

File Size 112.39K  /  2 Page

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Amphenol Communications Solutions

Part No. 131-8116-21D
Description Paladin® 112Gb/s Backplane Connector, 8-Pair, 6 Column, Open Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

For 8116 Found Datasheets File :: 101+       Page :: | 1 | 2 | 3 | 4 | <5> | 6 | 7 | 8 | 9 | 10 | 11 |   

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