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Amphenol Communications Solutions |
Part No. |
75844-879-14LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 14 Positions, 2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
0879143435 87914-3435
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Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 34 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 34 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plating, Tray Packaging, Lead-free
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File Size |
3,776.94K /
48 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
57102-G06-16ULF
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Description |
Minitek®, Board/Wire to Board Connectors, Unshrouded Headers - Through Hole - Double row - 32 Positions - 2mm (0.079inch) - Vertical
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
87061-605LF
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Description |
Quickie® IDC Cable-to-Board Connector System, Eject Latch Header, Through Hole, Right Angle, Double Row, Stacked 4 Wall, 20 Positions, 2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
0879145016 87914-5016
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Description |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 50 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 50 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
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File Size |
3,779.55K /
48 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
98414-G06-16LF
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Description |
Minitek®, Board/Wire to Board Connectors, Shrouded Header - Through Mount - Double row - 16 Positions - 2mm (0.079inch) - Vertical
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
68020-616
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Description |
BergStik®, Board to Board connector, Unshrouded Right angled Header, Through Hole, Double Row, 16 Positions, 2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
87914-2816 0879142816
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Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 28 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 28 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
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File Size |
3,779.54K /
48 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
57102-G06-16LF
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Description |
Minitek®, Board/Wire to Board Connectors, Unshrouded Headers - Through Hole - Double row - 32 Positions - 2mm (0.079inch) - Vertical
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
61082-061622LF
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Description |
BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 60 Positions.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
51940-616LF
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Description |
PwrBlade®, Power Supply Connectors, 3ACP 8S 4P Vertical Receptacle.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
10130616-067RDLF
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Description |
PCIe M.2 Connectors, Storage and Server Connector, P=0.5mm, H4.2mm, Key M, 30u\\ Au Plating .
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
61082-061600LF
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Description |
BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 60 Positions.
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Tech specs |
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Official Product Page
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