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  AN-6083 Datasheet PDF File

For AN-6083 Found Datasheets File :: 146+       Page :: | 1 | 2 | 3 | 4 | <5> | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    STMICROELECTRONICS[STMicroelectronics]
Part No. STS3DNE60L 6083
Description N - CHANNEL 60V - 0.065ohm - 3A SO-8 STripFET POWER MOSFET
From old datasheet system
N - CHANNEL 60V - 0.065 - 3A SO-8 STripFET TM POWER MOSFET

File Size 70.29K  /  5 Page

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Amphenol Communications Solutions

Part No. 75160-839-36LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, through hole, single Row,36 position, 2.54mm pitch
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    Kingbright Electronic
Part No. AP16083C AP1608S4C
Description In ra-red emitting diode. 1.6mm x 0.8mm SMT LED. Peak wavelength 940 nm. Lens type water clear.
In ra-red emitting diode. 1.6mm x 0.8mm SMT LED. Peak wavelength 880 nm. Lens type water clear.

File Size 117.13K  /  5 Page

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Amphenol Communications Solutions

Part No. G832MC030608322HR
Description 0.80mm Board-to-Board 100Ω Connector, Pitch 0.8mm, Height 18.7 mm, 60 Positions, Dual Row, BTB Vertical Receptacle SMT, 8u\\ Gold White.
Tech specs    

Official Product Page

    K4S560832B K4S560832B-TC_L1H K4S560832B-TC_L1L K4S560832B-TC_L75 K4S560832B-TC/L75 K4S560832B-TC/L1L K4S560832B-TC/L1H

Samsung Electronic
SAMSUNG[Samsung semiconductor]
SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. K4S560832B K4S560832B-TC_L1H K4S560832B-TC_L1L K4S560832B-TC_L75 K4S560832B-TC/L75 K4S560832B-TC/L1L K4S560832B-TC/L1H
Description 256Mbit SDRAM 8M x 8bit x 4 Banks Synchronous DRAM LVTTL

File Size 130.10K  /  11 Page

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Amphenol Communications Solutions

Part No. G832MC010608322HR
Description 0.80mm Board-to-Board 100Ω Connector, Pitch 0.8mm, Height 18.7 mm, 60 Positions, Dual Row, BTB Vertical Receptacle SMT, 8u\\ Gold Black.
Tech specs    

Official Product Page

    0009016083 09-01-6083 2574-8A4

Molex Electronics Ltd.
Part No. 0009016083 09-01-6083 2574-8A4
Description 3.96mm (.156) Pitch KK? Crimp Housing, Edge Card Connector, Single-Sided, Surface Mount, Polarized, Without Flange, 8 Circuits, Rib between 5 & 6
MOLEX Connector

File Size 367.56K  /  4 Page

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Amphenol Communications Solutions

Part No. 10137926-0831LF
Description Minitek® Pwr 3.0, Dual Row, Vertical SMT Tails and Hold Down Header, 15u\\ Gold (Tin on Tails) plating, Black Color, 8 Positions, GW Compatible LCP, Tape and Reel with cap.
Tech specs    

Official Product Page

    K4S560832D K4S560832D-TC_L1H K4S560832D-TC_L1L K4S560832D-TC_L75 K4S560832D-TC_L7C K4S560832D-TC/L1H K4S560832D-TC/L1L K

Samsung Electronic
SAMSUNG[Samsung semiconductor]
Part No. K4S560832D K4S560832D-TC_L1H K4S560832D-TC_L1L K4S560832D-TC_L75 K4S560832D-TC_L7C K4S560832D-TC/L1H K4S560832D-TC/L1L K4S560832D-TC/L75 K4S560832D-TC/L7C
Description 256Mbit SDRAM 8M x 8bit x 4 Banks Synchronous DRAM LVTTL

File Size 116.54K  /  11 Page

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Amphenol Communications Solutions

Part No. 10137926-0832LF
Description Minitek® Pwr 3.0, Dual Row, Vertical SMT Tails and Hold Down Header, 15u\\ Gold (Tin on Tails) plating, Black Color, 8 Positions, Non GW Compatible LCP, Tape and Reel with cap.
Tech specs    

Official Product Page

    K4S560832A K4S560832A-TC_L1H K4S560832A-TC_L1L K4S560832A-TC_L75 K4S560832A-TC_L80 K4S560832A-TC/L80 K4S560832A-TC/L1H K

SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
Samsung Electronic
Part No. K4S560832A K4S560832A-TC_L1H K4S560832A-TC_L1L K4S560832A-TC_L75 K4S560832A-TC_L80 K4S560832A-TC/L80 K4S560832A-TC/L1H K4S560832A-TC/L1L K4S560832A-TC/L75
Description 256Mbit SDRAM 8M x 8bit x 4 Banks Synchronous DRAM LVTTL
IC,SDRAM,4X8MX8,CMOS,TSOP,54PIN,PLASTIC

File Size 125.57K  /  10 Page

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Amphenol Communications Solutions

Part No. 10136656-0832NLF
Description Minitek® Pwr 3.0, Single Row, Vertical Through Hole Header, 15u\\ Gold (Tin on Tails) plating, 8 Positions, Natural Color, Non GW Compatible LCP, Tray packing.
Tech specs    

Official Product Page

    K4H560838E-GCCC K4H560838E-GCC4

Samsung semiconductor
Part No. K4H560838E-GCCC K4H560838E-GCC4
Description    256Mb E-die DDR 400 SDRAM Specification 60Ball FBGA (x4/x8)

File Size 198.99K  /  18 Page

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Amphenol Communications Solutions

Part No. 75160-835-16LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, through hole, single Row,16 position, 2.54mm pitch
Tech specs    

Official Product Page

   
Part No. K4C560838F-TCDA0
Description
File Size 770.14K  /  41 Page

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Amphenol Communications Solutions

Part No. 75160-839-15LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, through hole, single Row,15 position, 2.54mm pitch
Tech specs    

Official Product Page

   
Part No. K4H560838E-VCB00
Description 32M X 8 DDR DRAM, 0.75 ns, PDSO54

File Size 356.95K  /  24 Page

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Amphenol Communications Solutions

Part No. 10136656-0832LF
Description Minitek® Pwr 3.0, Single Row, Vertical Through Hole Header, 15u\\ Gold (Tin on Tails) plating, 8 Positions, Black Color, Non GW Compatible LCP, Tray packing.
Tech specs    

Official Product Page

    Samsung Electronic
Part No. K4S560832D-NCL7C
Description 8M x 8bit x 4 banks synchronous DRAM LVTTL, 133MHz

File Size 78.93K  /  9 Page

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Amphenol Communications Solutions

Part No. RJHSE6083
Description Modular Jack - 8P8C, Vertical, Single Port, With Panel Stops, No Shield, With LEDs
Tech specs    

Official Product Page

For AN-6083 Found Datasheets File :: 146+       Page :: | 1 | 2 | 3 | 4 | <5> | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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