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Silicon Laboratories Inc.
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| Part No. |
SI3200-FS SI3200-BS SI3200-GS SI3200-KS
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| OCR Text |
...package provides adequate power dissipating margin. (See "Typical Design Example" on page 6).
I LIM + I BIAS P Z = 2 x V Z x ---------------------------- min
Equation 6.Offload Resistor Calculation Choose the standard 5% resistor value ... |
| Description |
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| File Size |
76.40K /
8 Page |
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SGS Thomson Microelectronics
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| Part No. |
AN261
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| OCR Text |
...he example device consists of a dissipating element (integrated circuit) soldered on a copper frame surrounded by a plastic compound with no external heat sink. Its equivalent electrical circuit is shown in figure 2. The first cell, shown i... |
| Description |
DESIGNING WITH THERMAL IMPEDANCE
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| File Size |
185.95K /
15 Page |
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Philips
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| Part No. |
TDA1517P TDA1517 TDA1517TDA1517P
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| OCR Text |
...in (SIL9MPF) and a plastic heat-dissipating dual in-line package (HDIP18). The device is primarily developed for multi-media applications.
MIN. 6.0 -
TYP. 14.4 40 0.1 - - 5 6 - - 20 50 -
MAX. 18.0 2.5 80 100 40 - - - - - 21 - 150
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| Description |
From old datasheet system
2 x 6 W stereo power amplifier
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| File Size |
76.10K /
16 Page |
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SGS Thomson Microelectronics
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| Part No. |
AN262
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| OCR Text |
...e related factors ? size of the dissipating element ? dissipation level ? pulse length and duty cycle 2) package related factors ? thermal conductivity of the frame ? frame design 3) substrate related factors ? thermal conductivity of the s... |
| Description |
THERMAL MANAGEMENT IN SOURFACE MOUNTING
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| File Size |
419.39K /
15 Page |
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TY Semiconductor Co., Ltd
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| Part No. |
L6205
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| OCR Text |
...on a multi-layer fr4 pcb with a dissipating copper surface on the bottom side of 6cm 2 (with a thickness of 35m). 40 51 - c/w r th-j-amb1 maximum thermal resistance junction-ambient 2 (2) mounted on a multi-layer fr4 pcb with a dissipati... |
| Description |
OPERATING SUPPLY VOLTAGE FROM 8 TO 52V
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| File Size |
180.62K /
6 Page |
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it Online |
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