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PHILIPS[Philips Semiconductors]
NXP Semiconductors N.V.
International Rectifier, Corp.
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| Part No. |
BYG26J BYG26 BYG26D BYG26G BYG26_SERIES_1 BYG26SERIES
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| Description |
From old datasheet system
SMA ultra fast soft-recovery controlled avalanche rectifiers
Panel Meter, Moving-Magnet, ME Series, 2 inch Edgewise, 0-500 Microampere Range
Very low drop voltage regulators with inhibit 形状记忆合金超快速软恢复控制雪崩整流
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| File Size |
60.15K /
12 Page |
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it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
L77HDAG26SOL2C309
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| Description |
Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.76m (30 in) Gold, M3 Rear Nut Height 5.9mm, Without Bracket, Without Boardlock
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
L177HDAG26SOL2RM5
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| Description |
Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38m (15 in) Gold, M3 Rear Threaded Insert, M3 Threaded Standoff 6.0mm (0.236\\), With Boardlock 4.2mm (0.165\\)
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
L77HDAG26SOL2
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| Description |
Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, Flash Gold, M3 Rear Nut Height 5.9mm, Without Bracket, Without Boardlock
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
L177HDAG26S
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| Description |
Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 26 Socket, 0.38m (15 in) Gold, M3 Rear Threaded Insert, Without Bracket, Without Boardlock
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
L77HDAG26SOL2RM5C309
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| Description |
Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.76m (30 in) Gold, M3 Rear Threaded Insert, M3 Threaded Standoff 6.0mm (0.236\\), With Boardlock 4.2mm (0.165\\)
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
L77HDAG26SOL2RM8
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| Description |
Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, Flash Gold, M3 Fixed Front Screwlock, Standoff 6.0mm (0.236\\), With Boardlock 4.2mm (0.165\\)
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
L177HDAG26SOL2RM8
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| Description |
Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38m (15 in) Gold, M3 Fixed Front Screwlock, Standoff 6.0mm (0.236\\), With Boardlock 4.2mm (0.165\\)
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| Tech specs |
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Official Product Page
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LAPIS SEMICONDUCTOR CO LTD
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| Part No. |
OL3450L-A-SFMUJ-S2 OL4451L-B-AFMUJ-S1 OL5451L-B-AFMUJ-S1 OL6451L-A-AFMUJ-S1
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| Description |
FIBER OPTIC LASER DIODE MODULE EMITTER, 1300-1320nm, PANEL MOUNT, THROUGH HOLE MOUNT, MU-J CONNECTOR
FIBER OPTIC LASER DIODE MODULE EMITTER, 1480-1500nm, PANEL MOUNT, THROUGH HOLE MOUNT, MU-J CONNECTOR
FIBER OPTIC LASER DIODE MODULE EMITTER, 1510-1530nm, PANEL MOUNT, THROUGH HOLE MOUNT, MU-J CONNECTOR
FIBER OPTIC LASER DIODE MODULE EMITTER, 1620-1640nm, PANEL MOUNT, THROUGH HOLE MOUNT, MU-J CONNECTOR
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| File Size |
117.20K /
7 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
L77HDAG26SOL2RM5
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| Description |
Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, Flash Gold, M3 Rear Threaded Insert, M3 Threaded Standoff 6.0mm (0.236\\), With Boardlock 4.2mm (0.165\\)
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
L177HDAG26SOL2
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| Description |
Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38um (15u\\) Gold, M3 Rear Nut Height 5.9mm, Without Bracket, Without Boardlock
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
L177HRAG26S
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| Description |
Dsub, Straight, High Density, Housing only, Crimp & Poke, Bright Tin Shell, 26 Socket, M3 Rear Nut
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| Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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