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  FSP300-60DL Datasheet PDF File

For FSP300-60DL Found Datasheets File :: 69+       Page :: | 1 | 2 | 3 | 4 | <5> | 6 | 7 |   

    EUPEC[eupec GmbH]
Part No. BSM150GB60DLC
Description    IGBT-Modules

File Size 74.09K  /  8 Page

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Amphenol Communications Solutions

Part No. 50009-1260DLF
Description High Pin Count, Backplane Connectors, Header, Vertical, Press-Fit, 4 Row, 260 Positions, 0 Guide Pin, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    BSM300GB60DLC

Infineon Technologies AG
Part No. BSM300GB60DLC
Description High Efficient Rectifier Diodes IGBT模块

File Size 74.78K  /  8 Page

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Amphenol Communications Solutions

Part No. 50015-1160DLF
Description High Pin Count, Backplane Connectors, Header, Vertical, Through Hole, 4 Row, 160 Positions, 0 Guide Pin, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    BSM200GD60DLC

eupec GmbH
Part No. BSM200GD60DLC
Description IGBT-Module

File Size 105.12K  /  9 Page

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    STGW40H60DLFB

STMicroelectronics
Part No. STGW40H60DLFB
Description High speed switching series

File Size 1,462.73K  /  17 Page

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Part No. IBM11J4360DLA-70
Description 4M X 36 MULTI DEVICE DRAM CARD, 70 ns, XMA88

File Size 511.74K  /  16 Page

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    Eupec
Part No. BSM200GB60DLC
Description IGBT Power Module

File Size 76.94K  /  8 Page

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    BSM100GD60DLC

Infineon Technologies AG
Part No. BSM100GD60DLC
Description IGBT-Modules

File Size 136.50K  /  10 Page

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    EUPEC[eupec GmbH]
Part No. BSM100GB60DLC
Description IGBT-Modules

File Size 97.40K  /  9 Page

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    BSM300GB60DLC

eupec GmbH
Part No. BSM300GB60DLC
Description IGBT-Modules

File Size 123.16K  /  9 Page

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    STGW30H60DLFB

STMicroelectronics
Part No. STGW30H60DLFB
Description    High speed switching series

File Size 1,716.10K  /  20 Page

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For FSP300-60DL Found Datasheets File :: 69+       Page :: | 1 | 2 | 3 | 4 | <5> | 6 | 7 |   

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