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Amphenol Communications Solutions |
| Part No. |
10137785-042222LF
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| Description |
Minitek® Pwr 4.2 HCC, Single Row, Vertical Through Hole Header, Nylon 66, Gold Flash plating, Black Color, 4 Positions, Non GW Compatible, without Post, Tray packing.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10127820-0422CLF
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| Description |
Minitek® Pwr 4.2, Dual Row, Vertical Through Hole Header, 80u\\ Min Tin plating, Natural Color, 4 Positions, Non GW Compatible Nylon66, Tape and Reel with cap.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10127820-0422LCLF
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| Description |
Minitek® Pwr 4.2, Dual Row, Vertical Through Hole Header, 80u\\ Min Tin plating, Natural Color, 4 Positions, LCP, GW Compatible, Taoe and Reel with cap.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10127820-0422GCLF
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| Description |
Minitek® Pwr 4.2, Dual Row, Vertical Through Hole Header, 80u\\ Min Tin plating, Natural Color, 4 Positions, GW Compatible Nylon66, Tape and Reel with cap.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
G88MPH0422CEU
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| Description |
Micro Power Plus 3.0 Connector System - G88MP Series, Wire to Board connector, Housing, Dual row, 3.0mm pitch, 4 positions, Ny66, Black, BAG
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10134160-4220LF
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| Description |
Minitek® Pwr 3.0, Receptacle Terminal, 30u\\ Gold Plating, Chrysocal, AWG(#20-24).
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
G88MPH0422AEU
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| Description |
Micro Power Plus, Housing, Dual row, 3.0mm pitch, 4 positions, Ny66, Black, BAG
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68004-229HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 29 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318in) Mating, 2.72 mm (0.107in) Tail.
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Official Product Page
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Agilent (Hewlett-Packard)
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| Part No. |
HDMP-3001 HDMP-3001K
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| Description |
Telecommunication IC
HDMP-3001K · Evaluation Board for Multi-Protocol IC (MPIC) Ethernet Over SONET/SDH (EOS) Mapper
HDMP-3001 · Multi-Protocol IC (MPIC) Ethernet Over SONET/SDH (EOS) Mapper: Fast Ethernet to OC-3
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| File Size |
51.13K /
2 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
57102-G04-22LF
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| Description |
Minitek® 2.00mm, Board/Wire to Board Connector, 2.00mm (0,079in), Unshrouded Vertical Header, Through Hole, Double Row, 44 Positions
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68004-227HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 27 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318in) Mating, 2.72 mm (0.107in) Tail.
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Official Product Page
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Bom2Buy.com
Price and Availability
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