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  HDMP-1034 Datasheet PDF File

For HDMP-1034 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | <5> | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

   
Part No. HDMP-1024
Description Low Cost Gigabit Rate Receive Chip Set with TTL I/Os(带TTL输入/输出的低价格千兆位速率接收芯片)

File Size 365.93K  /  40 Page

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Amphenol Communications Solutions

Part No. 55510-346LF
Description <span style=\\background-color: #FFFF00\\><b>PREFERRED P/N SERIES FOR NEW PROJECT: 10131937</b></span><br><br>Minitek® 2.00mm, Board to Board Connector, PCB Mounted Receptacle , Vertical , Surface Mount, Double row, 46 Positions, 2.00mm (0.079in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    HDMP-1014 HDMP-1012

Agilent(Hewlett-Packard)
Part No. HDMP-1014 HDMP-1012
Description Bipolar Transistor; Collector Emitter Voltage, Vceo:400V; Transistor Polarity:N Channel; Power Dissipation:250W; C-E Breakdown Voltage:400V; DC Current Gain Min (hfe):10; Collector Current:50A; Package/Case:TO-3
Phase Lock Loop (PLL) IC; Number of Circuits:1; Package/Case:14-DIP; Mounting Type:Through Hole 4Low成本千兆速率发接收芯片

File Size 301.59K  /  42 Page

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Amphenol Communications Solutions

Part No. 76350-103-40LF
Description BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Double row , 40 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    HDMP-1512 HDMP-1514

Agilent(Hewlett-Packard)
Part No. HDMP-1512 HDMP-1514
Description Fibre Channel Transmitter Chipset(光纤通道传送芯
Fibre Channel Receiver Chipset(光纤通道接收芯片)

File Size 285.72K  /  26 Page

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Amphenol Communications Solutions

Part No. 55510-348LF
Description <span style=\\background-color: #FFFF00\\><b>PREFERRED P/N SERIES FOR NEW PROJECT: 10131937</b></span><br><br>Minitek® 2.00mm, Board to Board Connector, PCB Mounted Receptacle , Vertical , Surface Mount, Double row, 48 Positions, 2.00mm (0.079in) Pitch.
Tech specs    

Official Product Page

    HDMP-1012 HDMP-1014

Agilent (Hewlett-Packard)
HP[Agilent(Hewlett-Packard)]
Part No. HDMP-1012 HDMP-1014
Description 4Low Cost Gigabit Rate Transmit/Receive Chip Set

File Size 292.88K  /  42 Page

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Amphenol Communications Solutions

Part No. 66951-034LF
Description Dubox® 2.54mm, Board to Board Connector, PCB Mounted Receptacle, Vertical, Through Hole, Top Entry, Single Row, 34 position, 2.54mm (.100in) Pitch.
Tech specs    

Official Product Page

    HDMP-1022 HDMP-1024

Agilent (Hewlett-Packard)
HP[Agilent(Hewlett-Packard)]
Part No. HDMP-1022 HDMP-1024
Description Low Cost Gigabit Rate Transmit/Receive Chip Set with TTL I/Os

File Size 292.53K  /  40 Page

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Amphenol Communications Solutions

Part No. 54122-110341200LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 34 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    HDMP-1512 HDMP-1514

Agilent (Hewlett-Packard)
HP[Agilent(Hewlett-Packard)]
Part No. HDMP-1512 HDMP-1514
Description Fibre Channel Transmitter and Receiver Chipset

File Size 245.24K  /  26 Page

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Amphenol Communications Solutions

Part No. F32R-1A7A1-11034
Description Flex Connector, 0.50mm Pitch, Height 2.00mm, Right angle, Slider type, ZIF, Bottom contact, 34 position
Tech specs    

Official Product Page

    HDMP-1637A

Agilent (Hewlett-Packard)
Agilent(Hewlett-Packard)
Part No. HDMP-1637A
Description HDMP-1637A · 1.25 GBd SerDes Circuit with Differential PECL Clock Inputs for Gigabit Ethernet Applications
Gigabit Ethernet SerDes Circuit with Differential PECL Clock Inputs

File Size 242.38K  /  16 Page

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Amphenol Communications Solutions

Part No. RJMG221034450NR
Description RJMG, Input output Connectors, 2x1,1G,with LEDs
Tech specs    

Official Product Page

    Agilent (Hewlett-Packard)
Part No. HDMP-3001 HDMP-3001K
Description Telecommunication IC
HDMP-3001K · Evaluation Board for Multi-Protocol IC (MPIC) Ethernet Over SONET/SDH (EOS) Mapper
HDMP-3001 · Multi-Protocol IC (MPIC) Ethernet Over SONET/SDH (EOS) Mapper: Fast Ethernet to OC-3

File Size 51.13K  /  2 Page

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Amphenol Communications Solutions

Part No. 93690-103-44LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Press Fit, Double Row, 44 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    HDMP-1536 HDMP-1546

Agilent (Hewlett-Packard)
HP[Agilent(Hewlett-Packard)]
Part No. HDMP-1536 HDMP-1546
Description Fibre Channel Transceiver Chip

File Size 246.58K  /  15 Page

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Amphenol Communications Solutions

Part No. 54112-103400800LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 40 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    HDMP-1636 HDMP-1646

Dantona Industries, Inc.
HP[Agilent(Hewlett-Packard)]
Agilent (Hewlett-Packard)
Part No. HDMP-1636 HDMP-1646
Description Gigabit Ethernet Transceiver Chip 千兆以太网收发器芯片
Software

File Size 314.09K  /  15 Page

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Amphenol Communications Solutions

Part No. 63784-1034LF
Description Metral®, Backplane connectors, 1000 Series Header, Vertical Signal, 8 Row, Press-Fit, 96 Position, Select Load, Extended
Tech specs    

Official Product Page

For HDMP-1034 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | <5> | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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