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Device Engineering
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| Part No. |
DEI1073 DEI1075
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| OCR Text |
...q soic, thermal pad soldered to heat spreader land, 1.0 w junction temperature: tjmax, plastic packages (limited by molding compound tg) tjmax, ceramic packages 145 160 c c esd per jedec a114... |
| Description |
(DEI1073 - DEI1075) Arinc 429 Line Driver
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| File Size |
242.42K /
8 Page |
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it Online |
Download Datasheet
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Atmel
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| Part No. |
TS83102G0BMGS
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| OCR Text |
...is mandatory to use an external heat sink to improve dissipation by convection and conduction. the heat sink should be fixed in contact wi...spreader). the heat sink does not need to be electrically isolated, because the top of the package ... |
| Description |
This latest A/D converter is a thermally enhanced, pin-to-pin compatible version of the high-speed TS83102G0B ADC and is designed ...
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| File Size |
404.70K /
13 Page |
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it Online |
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PHILIPS
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| Part No. |
TDA8931T
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| OCR Text |
...has a high efficiency so that a heat sink is not required up to 20 W (RMS). The system operates on an asymmetrical and a symmetrical supply ...SPREADER 1 VSSD 10 VSSD 11 VSSD 20 VSSD
001aab807
OVP
HVPI
UVP
DIAG
Fig 1. Block dia... |
| Description |
From old datasheet system
Power comparator 1 X 20 W
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| File Size |
145.62K /
31 Page |
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it Online |
Download Datasheet |
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Price and Availability
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