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  MFR-1300 Datasheet PDF File

For MFR-1300 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | <5> | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    EPC-1300-1.0-1 EPC-1.00-1.0-1

EPIGAP optoelectronic GmbH
Part No. EPC-1300-1.0-1 EPC-1.00-1.0-1
Description Photodiode-Chip

File Size 119.99K  /  2 Page

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Rochester Electronics LLC

Part No. BLA1011-300
Description BLA1011-300 - 300W LDMOS Avionics Power Transistor
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    EPC-1300-1.0-2

EPIGAP optoelectronic GmbH
Part No. EPC-1300-1.0-2
Description Photodiode-Chip

File Size 122.56K  /  2 Page

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Toshiba Electronic Devices & Storage Corporation

Part No. XPN1300ANC
Description N-ch MOSFET, 100 V, 30 A, 0.0133 Ω@10V, TSON Advance(WF)
Tech specs    

Official Product Page

    EPC-1300-1.0-3

EPIGAP optoelectronic GmbH
Part No. EPC-1300-1.0-3
Description Photodiode-Chip

File Size 121.29K  /  2 Page

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Amphenol Communications Solutions

Part No. 54112-801300800LF
Description BERGSTIK STACKING
Tech specs    

Official Product Page

    EPC-1300-1.0-4

EPIGAP optoelectronic GmbH
Part No. EPC-1300-1.0-4
Description Photodiode-Chip

File Size 122.52K  /  2 Page

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Amphenol Communications Solutions

Part No. 92813-007LF
Description Minitek® 2.00mm, Board to Board, Unshrouded Vertical Stacking Header, Surface Mount, Double Row, 40 Positions, 2.00mm (0.079in) Pitch..
Tech specs    

Official Product Page

    EPC-1300-0.22-3

EPIGAP optoelectronic GmbH
Part No. EPC-1300-0.22-3
Description Photodiode-Chip

File Size 121.53K  /  2 Page

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Amphenol Communications Solutions

Part No. 92813-005LF
Description Minitek® 2.00mm, Board to Board, Unshrouded Vertical Stacking Header, Surface Mount, Double Row, 16 Positions, 2.00mm (0.079in) Pitch..
Tech specs    

Official Product Page

    EPC-1300-0.22-2

EPIGAP optoelectronic GmbH
Part No. EPC-1300-0.22-2
Description Photodiode-Chip

File Size 122.66K  /  2 Page

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Amphenol Communications Solutions

Part No. 10061913-003CLF
Description PCI Express® GEN 3 Card Edge, Storage and Server Connector, Vertical, Surface Mount, x16, 164 Positions, 1.00mm (0.039in) Pitch
Tech specs    

Official Product Page

    EPC-1300-0.22-4

EPIGAP optoelectronic GmbH
Part No. EPC-1300-0.22-4
Description Photodiode-Chip

File Size 121.80K  /  2 Page

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Amphenol Communications Solutions

Part No. 54121-112021300LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 2 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    EPC-1300-0.22-1

EPIGAP optoelectronic GmbH
Part No. EPC-1300-0.22-1
Description Photodiode-Chip

File Size 121.66K  /  2 Page

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Amphenol Communications Solutions

Part No. 54121-407031300LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 3 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    F28-1300

TRIAD MAGNETICS
Part No. F28-1300
Description PC MOUNT : SPLIT PACK

File Size 80.84K  /  1 Page

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Amphenol Communications Solutions

Part No. 75188-130-03LF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical header, Through Hole, Single Row, 3 Positions, 5.08mm (0.200in) Pitch.
Tech specs    

Official Product Page

    F28-1300-C2

TRIAD MAGNETICS
Part No. F28-1300-C2
Description CLASS 2/3 TRANSFORMER

File Size 39.75K  /  1 Page

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Amphenol Communications Solutions

Part No. 54121-808121300LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 12 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

For MFR-1300 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | <5> | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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