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  microcap Datasheet PDF File

For microcap Found Datasheets File :: 47    Search Time::4.906ms    
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    ACMD-6013 ACMD-6013-TR1 ACMD-6013-BLK

AVAGO TECHNOLOGIES LIMI...
Broadcom Corporation.
Part No. ACMD-6013 ACMD-6013-TR1 ACMD-6013-BLK
OCR Text ...es avago technologies advanced microcap bonded-wafer, chip scale packaging technology. this process allows the filters to be assembled into a molded chip-on-board module with an overall size of only 2.0 x 2.5 mm and maximum height of 0...
Description LTE Band 13 Duplexer with Public Safety Band Rejection

File Size 213.83K  /  2 Page

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    AVAGO TECHNOLOGIES LIMI...
Part No. ACMD-6025
OCR Text ...es avago technologies advanced microcap bonded-wafer, chip scale packaging technology. this process allows the flters to be assembled into a molded chip-on-board module with an overall size of only 2.0 x 2.5 mm and maximum height of 0.9...
Description Duplexer for LTE Band 25

File Size 224.63K  /  2 Page

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    ACMD-6102

AVAGO TECHNOLOGIES LIMI...
Broadcom Corporation.
Part No. ACMD-6102
OCR Text ... avago technologies ad - vanced microcap bonded-wafer, chip scale packaging technology. this process allows the flters to be assembled into a molded chip-on-board module with an overall size of only 1.6 x 2.0 mm and height of 0.9 mm. the...
Description Band 2 Duplexer

File Size 168.95K  /  2 Page

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    AVAGO TECHNOLOGIES LIMI...
Part No. ACMD-6107
OCR Text ... avago technologies ad - vanced microcap bonded-wafer, chip scale packaging technology. this process allows the flters to be assembled into a molded chip-on-board module with an overall size of only 1.6 x 2.0 mm and maximum height of 0.9...
Description LTE Band 7 Duplexer

File Size 89.75K  /  2 Page

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    ACFM-2113

Broadcom Corporation.
Part No. ACFM-2113
OCR Text ... avago technologies' innovative microcap bonded-wafer, chip scale packaging technology. this process allows the filters to be assembled in a module with a footprint of only 2 x 2.5 mm with a maximum height of 0.80 mm. low tx insertion l...
Description Band 1/Band 3 Quadplexer

File Size 319.09K  /  2 Page

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    AVAGO TECHNOLOGIES LIMI...
Part No. ACFM-7103-TR1
OCR Text ...vago technologies innovative microcap bonded-wafer, chip scale packaging technol - ogy. this process allows the flters to be assembled in a module with a footprint of only 4 x 7 mm and maximum height of 1.2 mm. low tx ...
Description Single Antenna connection for PCS and Cell band duplexers

File Size 1,771.80K  /  20 Page

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    ACFM-W1G7

Broadcom Corporation.
Part No. ACFM-W1G7
OCR Text ...avago technolo gies' innovative microcap bonded-wafer, chip scale packaging technology. this process allows the filters to be assembled in a module with a footprint of only 2.5 mm 2.5 mm with a maximum height of 0.80 mm. the acfm-w1g7 ...
Description Mid/High Cellular Bands, Wi-Fi, GNSS Triplexer

File Size 179.55K  /  2 Page

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For microcap Found Datasheets File :: 47    Search Time::4.906ms    
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