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AVAGO TECHNOLOGIES LIMI...
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Part No. |
ACMD-6025
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OCR Text |
...es avago technologies advanced microcap bonded-wafer, chip scale packaging technology. this process allows the flters to be assembled into a molded chip-on-board module with an overall size of only 2.0 x 2.5 mm and maximum height of 0.9... |
Description |
Duplexer for LTE Band 25
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File Size |
224.63K /
2 Page |
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it Online |
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AVAGO TECHNOLOGIES LIMI...
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Part No. |
ACMD-6107
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OCR Text |
... avago technologies ad - vanced microcap bonded-wafer, chip scale packaging technology. this process allows the flters to be assembled into a molded chip-on-board module with an overall size of only 1.6 x 2.0 mm and maximum height of 0.9... |
Description |
LTE Band 7 Duplexer
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File Size |
89.75K /
2 Page |
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it Online |
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AVAGO TECHNOLOGIES LIMI...
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Part No. |
ACFM-7103-TR1
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OCR Text |
...vago technologies innovative microcap bonded-wafer, chip scale packaging technol - ogy. this process allows the flters to be assembled in a module with a footprint of only 4 x 7 mm and maximum height of 1.2 mm. low tx ... |
Description |
Single Antenna connection for PCS and Cell band duplexers
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File Size |
1,771.80K /
20 Page |
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it Online |
Download Datasheet
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