OSC-15801 pdf Datasheet P5 Part Num --- IC-ON-LINE


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OSC-15801 Datasheet PDF File

For OSC-15801 Found Datasheets File :: 117+ Page :: | 1 | 2 | 3 | 4 | <5> | 6 | 7 | 8 | 9 | 10 | 11 | 12 |

					Molex Electronics Ltd.
Part No.	A-70567-0363 15-80-1501 0015801501
Description	2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 50 Circuits, 0.76渭m (30渭) Gold, (Au) Selective Pla 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 50 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating
File Size	1,218.39K / 7 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	77315-801-31LF
Description	BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 31 Positions 2.54mm (0.100in) Pitch, Right Angle
Tech specs				Official Product Page

HUA FENG CIRCUIT

					CTS CORP
Part No.	OSC1205B OSC1205F
Description	TCXO, SINE OUTPUT, 19.68 MHz
File Size	623.96K / 2 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	77315-801-07LF
Description	BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 7 Positions 2.54mm (0.100in) Pitch, Right Angle
Tech specs				Official Product Page

					CTS CORP
Part No.	OSC1205E OSC1205A
Description	TCXO, SINE OUTPUT, 19.68 MHz
File Size	624.10K / 2 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	77315-801-27LF
Description	BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 27 Positions 2.54mm (0.100in) Pitch, Right Angle
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	A-70567-0349 15-80-1221 0015801221
Description	2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, 0.76渭m (30渭) Gold, (Au) Selective Pla 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating
File Size	1,218.39K / 7 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	77315-801-22LF
Description	BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 22 Positions 2.54mm (0.100in) Pitch, Right Angle
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	A-70567-0348 15-80-1201 0015801201
Description	2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, 0.76渭m (30渭) Gold, (Au) Selective Pla 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating
File Size	1,218.35K / 7 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	77315-801-16LF
Description	BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 16 Positions 2.54mm (0.100in) Pitch, Right Angle
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	A-70567-0346 15-80-1161 0015801161
Description	2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.76渭m (30渭) Gold, (Au) Selective Pla 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating
File Size	1,218.35K / 7 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	77315-801-12LF
Description	BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 12 Positions 2.54mm (0.100in) Pitch, Right Angle
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	A-70567-0344 15-80-1121 0015801121
Description	2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.76渭m (30渭) Gold, (Au) Selective Pla 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating
File Size	1,218.35K / 7 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	77315-801-13LF
Description	BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 13 Positions 2.54mm (0.100in) Pitch, Right Angle
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	A-70567-0343 15-80-1101 0015801101
Description	2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.76渭m (30渭) Gold, (Au) Selective Pla 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating
File Size	1,218.38K / 7 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	77315-801-08LF
Description	BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 8 Positions 2.54mm (0.100in) Pitch.
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	A-70567-0341 15-80-1061 0015801061
Description	2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.76渭m (30渭) Gold, (Au) Selective Plat 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating
File Size	1,218.39K / 7 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	77315-801-05LF
Description	BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 5 Positions 2.54mm (0.100in) Pitch, Right Angle
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	A-70567-0358 15-80-1401 0015801401
Description	2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 40 Circuits, 0.76渭m (30渭) Gold, (Au) Selective Pla 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 40 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating
File Size	1,218.39K / 7 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	77315-801-35LF
Description	BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 35 Positions 2.54mm (0.100in) Pitch, Right Angle
Tech specs				Official Product Page

For OSC-15801 Found Datasheets File :: 117+ Page :: | 1 | 2 | 3 | 4 | <5> | 6 | 7 | 8 | 9 | 10 | 11 | 12 |

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