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For underside Found Datasheets File :: 2322 Search Time::2.985ms
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				MAXIM - Dallas Semiconductor MAXIM[Maxim Integrated Products]
Part No.	MAX1978 MAX1978ETM MAX1979ETM MAX1979 MAX1978-MAX1979
OCR Text	... *ELECTRICALLY CONNECTED TO THE underside METAL SLUG. NOTE: GND IS CONNECTED TO THE underside METAL SLUG. ________________________________________________________________ Maxim Integrated Products AIN+ AINAOUT UT 1 For pricin...
Description	Integrated Temperature Controllers for Peltier Modules
File Size	616.00K / 20 Page	View it Online	Download Datasheet

				Agilent (Hewlett-Packard) HP[Agilent(Hewlett-Packard)]
Part No.	HCPL3150 HCPL-3150 HCPL-3150060 HCPL-3150300 HCPL-3150500
OCR Text	... Thermocouple located at center underside of package 28 Fig. Note 8, 9 1012 0.6 391 439 119 pF C/W C/W C/W 9 All typical values at TA = 25C and VCC - VEE = 30 V, unless otherwise noted. *The Input-Output Momentary Withstand V...
Description	0.5 Amp Output Current IGBT Gate Drive Optocoupler
File Size	240.20K / 15 Page	View it Online	Download Datasheet

				Philips Semiconductors
Part No.	BFG135
OCR Text	...3, L6 and R2 are mounted on the underside of the PCB. The circuit is constructed on a double copper-clad printed circuit board with PTFE dielectric (r = 2.2); thickness 1 1 16 inch; thickness of copper sheet 32 inch. DESCRIPTION multilayer ...
Description	NPN 7GHz wideband transistor
File Size	101.96K / 12 Page	View it Online	Download Datasheet

				Agilent (Hewlett-Packard) Agilent(Hewlett-Packard)
Part No.	HCPL-3120
OCR Text	...Thermocoupler located at center underside of package 28 Fig. Note 8, 9 1012 0.6 467 442 126 9 **The Input-Output Momentary Withstand Voltage is a dielectric voltage rating that should not be interpreted as an input-output continuou...
Description	2.0 Amp Output Current IGBT Gate Drive Optocoupler
File Size	240.21K / 15 Page	View it Online	Download Datasheet

				HP[Agilent(Hewlett-Packard)]
Part No.	HCPL261A HCPL-263N HCPL-061A HCPL-061N HCPL-063A HCPL-063N HCPL-261A HCPL-261N HCPL-263A
OCR Text	...1 (0.002) "HP" IS MARKED ON THE underside OF THE PACKAGE DIMENSIONS IN MILLIMETERS AND (INCHES). 6 TEMPERATURE - C 260 240 220 200 180 160 140 120 100 80 60 40 20 0 0 T = 145C, 1C/SEC T = 115C, 0.3C/SEC T = 100C, 1.5C/SEC ...
Description	CMR 10MBd 驮CMR 、驮彳（10MBd）罡忑蒸?????? CMR ?10MBd ??? 高CMR 、高速（10MBd 低入力フォトカプ
File Size	152.72K / 15 Page	View it Online	Download Datasheet

				MAXIM - Dallas Semiconductor MAXIM[Maxim Integrated Products] Maixm Maxim Integrated Products, Inc.
Part No.	MAX2235 MAX2235EUP
OCR Text	...UTPUT STAGE IS CONNECTED TO THE underside METAL SLUG. NOTE: SOLDER underside OF METAL SLUG TO BOARD GND PLANE. ________________________________________________________________ Maxim Integrated Products 1 For free samples & the l...
Description	3.6V / 1W Autoramping Power Amplifier for 900MHz Applications 3.6V, 1W Autoramping Power Amplifier for 900MHz Applications 800 MHz - 1000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER
File Size	147.77K / 8 Page	View it Online	Download Datasheet

				Maxim Integrated Products, Inc. MAXIM[Maxim Integrated Products] MAXIM - Dallas Semiconductor
Part No.	MAX8890 MAX8890ETCGGG MAX8890ETCMMM MAX8890ETCDDD
OCR Text	...package with a metal pad on the underside. Features o Three 100mA Low-Dropout Linear Regulators o Low 50mV Dropout Voltage at 100mA o 1% Output Voltage Accuracy Over Temperature o Preset 1.8V to 3.3V Output Voltages (in 50mV Increments)...
Description	2.9 V, integrated cellular RF-section power-management IC 2.8 V, integrated cellular RF-section power-management IC Integrated Cellular RF-Section Power-Management IC 集成的蜂窝电RF部分电源管理IC 1.8 V, integrated cellular RF-section power-management IC
File Size	232.00K / 12 Page	View it Online	Download Datasheet

				RFMD[RF Micro Devices]
Part No.	RF3322 RF3322PCBA
OCR Text	...into consideration: * Make sure underside of package is soldered to a good ground on the PCB. * Move C2, C9, C10, and C11 as close to T1 as possible. * Keep input and output traces as short as possible. * Ensure a good ground plane by using...
Description	CABLE REVERSE PATH PROGRAMMABLE GAIN AMPLIFIER
File Size	167.72K / 14 Page	View it Online	Download Datasheet

				SemeLAB SEME-LAB[Seme LAB]
Part No.	2N3904CSM
OCR Text	... SOT23 CERAMIC (LCC1 PACKAGE) underside View PAD 1 - Base PAD 2 - Emitter PAD 3 - Collector APPLICATIONS: Hermetically sealed surface mount version of the popular 2N3904 for high reliability / space applications requiring small size a...
Description	GENERAL PURPOSE NPN TRANSISTOR IN A HERMETICALLY SEALED CERAMIC SURFACE MOUNT PACKAGE FOR HIGH RELIABILITY APPLICATIONS General Purpose NPN Transistor In a Hermetic Surface Mount Package For High Reliability Application(通用NPN晶体管（高可靠性、表贴型封装
File Size	20.62K / 2 Page	View it Online	Download Datasheet

				STMicroelectronics N.V. SEME-LAB[Seme LAB]
Part No.	2N2904
OCR Text	...ITCHING TO-39 METAL PACKAGE underside View PIN 1 - Emitter PIN 2 - Base PIN 3 - Collector ABSOLUTE MAXIMUM RATINGS (Tcase = 25C unless otherwise stated) VCEO VCBO VEBO IC PD PD TJ , TSTG Collector - Emitter Voltage Collector - Base ...
Description	High Speed, Saturated Switch PNP Silicon Transistor(高速、饱和开关型PNP硅晶体管) 高速，饱和硅晶体管开关进步党（高速，饱和开关型进步党硅晶体管） GENERAL PURPOSE PNP TRANSISTOR
File Size	18.05K / 2 Page	View it Online	Download Datasheet

For underside Found Datasheets File :: 2322 Search Time::2.985ms
Page :: | 1 | 2 | 3 | 4 | <5> | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |