| |
|
 |
Noritake Co., Inc.
|
| Part No. |
PUMA68F16006X-12 PUMA68F16006X-90
|
| OCR Text |
...e subjected to infrared reflow, vapour phase reflow, or equivalent processing (peak package body temp 220 o c) must be : a : mounted within 72 hours at factory conditions of <30 o c/60% rh or b : stored at <20% rh if these conditions are ... |
| Description |
45NS, VSOP, IND TEMP(FLASH)
45NS, PLCC, IND TEMP(FLASH) EEPROM
|
| File Size |
125.76K /
5 Page |
 View
it Online |
Download Datasheet
|
| |
|
|
SGS Thomson Microelectronics
|
| Part No. |
AN264
|
| OCR Text |
...ve 110 c/30s 260 c/3s 1, 2, 3 vapour phase 215 c/20s 1, 2 infra-red 160 c/30s > 210 c/60s 1 the reliability evaluation was performed by means of the following tests : operating life 150 c pressure pot 121 c/2atm thb 85 c/85% rh 15v ... |
| Description |
RESISTANCE TO SOLDERING HEAT AND THERMAL CHARACTERISTICS OF SMDS
|
| File Size |
154.13K /
11 Page |
View
it Online |
Download Datasheet |
| |
|
|
Noritake Co., Inc.
|
| Part No. |
PUMA68F4006X-12 PUMA68F4006X-90
|
| OCR Text |
...e subjected to infrared reflow, vapour phase reflow, or equivalent processing (peak package body temp 220 o c) must be : a : mounted within 72 hours at factory conditions of <30 o c/60% rh or b : stored at <20% rh if these conditions are ... |
| Description |
6K GATE, 2NS, 132 BQFP, COM TEMP(FPGA)
6K GATE, 4NS, 84 PLCC, COM TEMP(FPGA) EEPROM
|
| File Size |
120.64K /
5 Page |
View
it Online |
Download Datasheet |
| |
|
|
Littelfuse, Inc.
|
| Part No. |
MLE
|
| OCR Text |
...logy are Infrared (IR) re-flow, vapour phase re-flow, and wave soldering. When wave soldering, the MLE suppressor is attached to the circuit board by means of an adhesive. The assembly is then placed on a conveyor and run through the solder... |
| Description |
Multilayer Transient Voltage Suppressor
|
| File Size |
129.67K /
7 Page |
View
it Online |
Download Datasheet |
|
Price and Availability
|
