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  1611 Datasheet PDF File

For 1611 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | <6> | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    Macronix International Co., Ltd.
Part No. 23C1611-10 23C1611-12
Description 5 Volt 16-Mbit (2M x 8 / 1M x 16) Mask ROM with Page Mode

File Size 475.67K  /  9 Page

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Amphenol Communications Solutions

Part No. 131-6116-11H
Description Paladin® 112Gb/s Backplane Connector, 6-Pair, 6 Column, Open Wall, Backplane Module, 1.5mm Wipe, APP.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    Panasonic
Part No. 2SD1611
Description Power Device - Power Transistors - General-Purpose power amplification

File Size 84.57K  /  4 Page

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Amphenol Communications Solutions

Part No. 131-6116-11D
Description Paladin® 112Gb/s Backplane Connector, 6-Pair, 6 Column, Open Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    Samsung Semiconductor Co., Ltd.
Part No. KS16116-02
Description 9600 bps FAX MODEM(9600bps传真调制解调 9600 bps的传真调制解调器9600bps的传真调制解调器

File Size 25.32K  /  3 Page

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Amphenol Communications Solutions

Part No. 20021611-00012T1LF
Description 1.27mm (0.05in.) pitch, Header with eject latch, 12 contacts
Tech specs    

Official Product Page

    Samsung Semiconductor Co., Ltd.
Part No. KS16118
Description 9600bps FAX super one-chip(9600bps传真调制解调 9600bps传真超级单芯片(9600bps传真调制解调器)

File Size 27.07K  /  3 Page

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Amphenol Communications Solutions

Part No. 20021611-00030T1LF
Description 1.27mm (0.05in.) pitch, Header with eject latch, 30 contacts
Tech specs    

Official Product Page

    PANASONIC[Panasonic Semiconductor]
Part No. 2SD1611
Description Silicon NPN triple diffusion planar type Darlington(For power amplification)

File Size 62.42K  /  2 Page

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Amphenol Communications Solutions

Part No. 87916-113HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 13 Positions, 2.54mm Pitch, Vertical, 21.08mm (0.83in) Mating, 3.25mm (0.128in) Tail.
Tech specs    

Official Product Page

    2SA1611

SeCoS Halbleitertechnologie GmbH
Part No. 2SA1611
Description PNP Silicon Plastic Encapsulated Transistor

File Size 105.89K  /  1 Page

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Part No. 20021611-00040T8LF
Description 1.27mm (0.05in.) pitch, Header with eject latch, 40 contacts
Tech specs    

Official Product Page

    ShenZhen FreesCale Electronics. Co., Ltd
Part No. AON1611
Description 20V P-Channel MOSFET

File Size 252.26K  /  5 Page

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Amphenol Communications Solutions

Part No. 87916-111HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 11 Positions, 2.54mm Pitch, Vertical, 21.08mm (0.83in) Mating, 3.25mm (0.128in) Tail.
Tech specs    

Official Product Page

    pmc
Part No. 1991611
Description From old datasheet system

File Size 562.91K  /  103 Page

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Amphenol Communications Solutions

Part No. 20021611-00008T1LF
Description 1.27mm (0.05in.) pitch, Header with eject latch, 8 contacts
Tech specs    

Official Product Page

   
Part No. UC1611J
Description SILICON, RECTIFIER DIODE

File Size 209.53K  /  6 Page

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Amphenol Communications Solutions

Part No. U90H161100A
Description ExpressPort QSFP+, High Speed Input Output Connectors, QSFP 12.73MM HS 1X1.
Tech specs    

Official Product Page

    2SK1611

Panasonic Semiconductor
http://
Part No. 2SK1611
Description V(dss): 800V; silicon N-channel powe F-MOS FET. For high-speed switching, for high frequency power amplification
Silicon N-Channel Power F-MOS FET

File Size 35.34K  /  2 Page

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Amphenol Communications Solutions

Part No. 131-3516-11D
Description Paladin® 112Gb/s Backplane Connector, 3-Pair, 6 Column, Left Polarized, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

For 1611 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | <6> | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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