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  3323 Datasheet PDF File

For 3323 Found Datasheets File :: 137+       Page :: | 1 | 2 | 3 | 4 | 5 | <6> | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 |   

    Samsung Electronic
Part No. M366S3323DTU
Description 32Mx64 SDRAM DIMM based on 16Mx8, 4Banks, 4K Refresh, 3.3V Synchronous DRAMs with SPD Data Sheet

File Size 167.45K  /  11 Page

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Amphenol Communications Solutions

Part No. 70233-231LF
Description Metral® Board Connectors, Backplane Connectors, 4 Row Signal Header, 48 Position, Straight, Press-Fit, Wide body.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    Samsung Electronic
Part No. M366S3323AT0
Description 32MB x 64 SDRAM DIMM based on 16MB x 8, 4Banks, 4KB Refresh, 3.3V Synchronous DRAMs with SPD Data Sheet

File Size 152.29K  /  10 Page

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Amphenol Communications Solutions

Part No. 68033-232HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 32 Positions, 2.54 mm Pitch, Vertical, 3.42 mm (0.135in) Mating, 12.01 mm (0.473in) Tail.
Tech specs    

Official Product Page

    Samsung Electronic
Part No. M374S3323DTU
Description 32Mx72 SDRAM DIMM with ECC based on 16Mx8, 4Banks, 4K Refresh, 3.3V Synchronous DRAMs with SPD Data Sheet

File Size 164.10K  /  11 Page

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Amphenol Communications Solutions

Part No. 10131933-230ULF
Description Minitek®, Board to Board, Receptacle, Surface Mount, Double row, 30 Positions, 2mm (0.079inch), horizontal.
Tech specs    

Official Product Page

    SAMSUNG[Samsung semiconductor]
Part No. M366S3323CT0-C75 M366S3323CT0
Description 32Mx64 SDRAM DIMM based on 16Mx8, 4Banks, 4K Refresh, 3.3V Synchronous DRAMs with SPD

File Size 195.03K  /  9 Page

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Amphenol Communications Solutions

Part No. 76383-323LF
Description Dubox®2.54mm, Board to Board Connector, Shrouded Header, Double Row, Right Angle.
Tech specs    

Official Product Page

    SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
Samsung Electronic
Part No. M366S3323CT0-C1L M366S3323CT0 M366S3323CT0-C1H
Description PC100 Unbuffered DIMM
32MB x 64 SDRAM DIMM based on 16MB x 8, 4Banks, 4KB Refresh, 3.3V Synchronous DRAMs with SPD Serial Presence Detect

File Size 54.11K  /  7 Page

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Amphenol Communications Solutions

Part No. 10131933-232ULF
Description Minitek®, Board to Board, Receptacle, Surface Mount, Double row, 32 Positions, 2mm (0.079inch), horizontal.
Tech specs    

Official Product Page

   
Part No. AS7C33232-17TQC AS7C33232F-13QC AS7C33232F-13TQC AS7C33232F-17TQC AS7C33232F-17QC AS7C33232-15QC AS7C33232F-15QC AS7C33232-17QC AS7C33232F-10TQC
Description x32 Fast Synchronous SRAM X32号,快速同步SRAM

File Size 877.06K  /  12 Page

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Amphenol Communications Solutions

Part No. 68033-236HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 36 Positions, 2.54 mm Pitch, Vertical, 3.42 mm (0.135in) Mating, 12.01 mm (0.473in) Tail.
Tech specs    

Official Product Page

    SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. M366S3323DTS-C1H M366S3323DTS-L1H M366S3323DTS-C7C M366S3323DTS-L1L M366S3323DTS-C7A M366S3323DTS-L7A M366S3323DTS-L7C
Description 32Mx64 SDRAM DIMM based on 16Mx8, 4Banks, 4K Refresh, 3.3V Synchronous DRAMs with SPD

File Size 114.48K  /  11 Page

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Amphenol Communications Solutions

Part No. 10131933-236ULF
Description Minitek®, Board to Board, Receptacle, Surface Mount, Double row, 36 Positions, 2mm (0.079inch), horizontal.
Tech specs    

Official Product Page

    M366S3323DTS M366S3323DTS-C1H M366S3323DTS-C1L M366S3323DTS-C7A M366S3323DTS-C7C M366S3323DTS-L1H M366S3323DTS-L1L M366S

Samsung semiconductor
Samsung Electronic
Part No. M366S3323DTS M366S3323DTS-C1H M366S3323DTS-C1L M366S3323DTS-C7A M366S3323DTS-C7C M366S3323DTS-L1H M366S3323DTS-L1L M366S3323DTS-L7A M366S3323DTS-L7C
Description 32M X 64 SYNCHRONOUS DRAM MODULE, 6 ns, DMA168
32Mx64 SDRAM DIMM based on 16Mx8, 4Banks, 4K Refresh, 3.3V Synchronous DRAMs with SPD Data sheet

File Size 166.06K  /  11 Page

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Amphenol Communications Solutions

Part No. 85833-236LF
Description Metral® Board Connectors, Backplane Connectors, 5 Row Signal Header, Straight, Press-Fit, Wide body, 4 Mod.
Tech specs    

Official Product Page

    0011405350 63323B107 0011-40-5350 001140-5350

Molex Electronics Ltd.
Part No. 0011405350 63323B107 0011-40-5350 001140-5350
Description Insulation Punch

File Size 14.45K  /  1 Page

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Amphenol Communications Solutions

Part No. 10136647-033231LF
Description Minitek® Pwr 4.2, Single Row, Vertical Through Hole Header, LCP, 15u\\ Gold (Tin on Tails) plating, Black Color, 3 Positions, GW Compatible, with Posts, Tray packing.
Tech specs    

Official Product Page

    0011405349 63323B106 1140-5349 001140-5349

Molex Electronics Ltd.
Part No. 0011405349 63323B106 1140-5349 001140-5349
Description Conductor Punch

File Size 14.25K  /  1 Page

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Amphenol Communications Solutions

Part No. 69133-234
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 34 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

For 3323 Found Datasheets File :: 137+       Page :: | 1 | 2 | 3 | 4 | 5 | <6> | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 |   

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