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  4323-50MX50MM Datasheet PDF File

For 4323-50MX50MM Found Datasheets File :: 115+       Page :: | 1 | 2 | 3 | 4 | 5 | <6> | 7 | 8 | 9 | 10 | 11 | 12 |   

    Samsung Electronic
Part No. K4S643233E-SEN
Description 512K x 32Bit x 4 Banks Synchronous DRAM Data Sheet
File Size 70.19K  /  12 Page

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Amphenol Communications Solutions
Part No. 68684-323LF
Description Dubox® 2.54mm, Board to Board Connector, PCB Mounted Receptacle, Vertical, Through Hole, Dual Entry, Single Row, 23 Positions, 2.54mm (0.100in) Pitch..
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    K4S643233F-SE K4S643233F-DE K4S643233F-SE_P75 K4S643233F K4S643233F-DE_P1H K4S643233F-DE_P1L K4S643233F-DE_P75 K4S643233

SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
Samsung Electronic
Part No. K4S643233F-SE K4S643233F-DE K4S643233F-SE_P75 K4S643233F K4S643233F-DE_P1H K4S643233F-DE_P1L K4S643233F-DE_P75 K4S643233F-SE_I K4S643233F-SE_N K4S643233F-SE_P1H K4S643233F-SE_P1L K4S643233F-DE/P1H K4S643233F-DE/P1L K4S643233F-DE/P75 K4S643233F-SE/P1L K4S643233F-SE/P1H K4S643233F-SE/N K4S643233F-SE/I K4S643233F-SE/P75
Description Dual Low-Noise Precision Rail-To-Rail Operational Amplifier 14-SOIC
2Mx32 Mobile SDRAM 90FBGA CMOS SDRAM
From old datasheet system
File Size 61.65K  /  8 Page

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Amphenol Communications Solutions
Part No. 10136647-043232LF
Description Minitek® Pwr 4.2, Single Row, Vertical Through Hole Header, LCP, 15u\\ Gold (Tin on Tails) plating, Black Color, 4 Positions, GW Compatible, with out Posts, Tray packing.
Tech specs 　 　

Official Product Page

    K4S643232F-TP60 K4S643232F-TP70 K4S643232F- K4S643232F-TI60 K4S643232F-TI70

Samsung Electronic
SAMSUNG[Samsung semiconductor]
SAMSUNG SEMICONDUCTOR CO. LTD.
Samsung Semiconductor Co., Ltd.
Part No. K4S643232F-TP60 K4S643232F-TP70 K4S643232F- K4S643232F-TI60 K4S643232F-TI70
Description    2M x 32 SDRAM 512K x 32bit x 4 Banks Synchronous DRAM LVTTL3.3V
-2M x 32 SDRAM 512K x 32bit x 4 Banks Synchronous DRAM LVTTL3.3V
CONNECTOR ACCESSORY
2M x 32 SDRAM 512K x 32bit x 4 Banks Synchronous DRAM LVTTL3.3V 200万32内存12k × 32 × 4银行同步DRAM LVTTL3.3V
File Size 98.11K  /  12 Page

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Amphenol Communications Solutions
Part No. 10131934-323ULF
Description Minitek®, Board to Board, Receptacle, Through Mount, Single row, 23 Positions, 2mm (0.079inch), Vertical.
Tech specs 　 　

Official Product Page

    K4S643232E-TP60 K4S643232E-TP70 K4S643232E-TI K4S643232E-TI60 K4S643232E-TI70

Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
Samsung Electronic
Part No. K4S643232E-TP60 K4S643232E-TP70 K4S643232E-TI K4S643232E-TI60 K4S643232E-TI70
Description 2M x 32 SDRAM 512K x 32bit x 4 Banks Synchronous DRAM LVTTL 200万32内存12k × 32 × 4银行同步DRAM LVTTL
CONNECTOR ACCESSORY
IR LED 880NM 40 DEG SIDE VIEW
File Size 98.65K  /  12 Page

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Amphenol Communications Solutions
Part No. 10124323-401-01LF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Press Fit, Single row , Double Body, 1 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    LT1432-3.3 LT1432CN8-3.3 LT1432CS8-3.3 LT143233

Linear Technology
Part No. LT1432-3.3 LT1432CN8-3.3 LT1432CS8-3.3 LT143233
Description 3.3V High Efficiency Step-Down Switching Regulator Controller
From old datasheet system
File Size 218.01K  /  8 Page

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Amphenol Communications Solutions
Part No. 98432-312LF
Description RJ45 Modular Jack, Input Output Connectors, CAT 3, Standard, 6P4C, Vertical, Surface Mount, without Shield, 1 Port.
Tech specs 　 　

Official Product Page

    H8S-2350 HD6412350 HD6432351

Renesas Electronics Corporation
Part No. H8S-2350 HD6412350 HD6432351
Description 16-Bit Single-Chip Microcomputer
File Size 6,109.19K  /  1025 Page

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Amphenol Communications Solutions
Part No. 10136647-043231LF
Description Minitek® Pwr 4.2, Single Row, Vertical Through Hole Header, LCP, 15u\\ Gold (Tin on Tails) plating, Black Color, 4 Positions, GW Compatible, with Posts, Tray packing.
Tech specs 　 　

Official Product Page

    K4S643232E-TN70 K4S643232E-TE50 K4S643232E- K4S643232E-TE60 K4S643232E-TE70 K4S643232E-TN50 K4S643232E-TN60 K4S643232E

Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
Samsung Electronic
Part No. K4S643232E-TN70 K4S643232E-TE50 K4S643232E- K4S643232E-TE60 K4S643232E-TE70 K4S643232E-TN50 K4S643232E-TN60 K4S643232E
Description LED ORANGE DIFFUSED 2X5 RECT 200万32内存12k × 32 × 4银行同步DRAM LVTTL.3
2M x 32 SDRAM 512K x 32bit x 4 Banks Synchronous DRAM LVTTL(3.3V) 200万32内存12k × 32 × 4银行同步DRAM LVTTL.3
2M x 32 SDRAM 512K x 32bit x 4 Banks Synchronous DRAM LVTTL(3.3V) 200万32内存12k × 32 × 4银行同步DRAM LVTTL3.3
LED ORANGE DIFFUSED 2X5 RECT
CONNECTOR ACCESSORY
LED ORG/RED DIFFUSED 2X5MM RECT
-2M x 32 SDRAM 512K x 32bit x 4 Banks Synchronous DRAM LVTTL(3.3V)
File Size 99.80K  /  12 Page

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Amphenol Communications Solutions
Part No. 91614-323LF
Description Dubox® 2.54mm, Board to Board Connector, PCB Mounted Receptacle, Vertical, Surface Mount, Dual Entry, Single Row, 23 Position ,2.54mm (0.100in) Pitch
Tech specs 　 　

Official Product Page

    H8S2337 H8S2338 H8S2339 HD6432337 HD6432338

Renesas Electronics Corporation
Part No. H8S2337 H8S2338 H8S2339 HD6432337 HD6432338
Description Renesas 16-Bit Single-Chip Microcomputer H8S Family/H8S/2300 Series
File Size 6,430.75K  /  1244 Page

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Amphenol Communications Solutions
Part No. 98432-311LF
Description RJ45 Modular Jack, Input Output Connectors, CAT 3, Standard, 6P6C, Vertical, Surface Mount, without Shield, 1 Port.
Tech specs 　 　

Official Product Page

    HD6472355 HD6432353 HD6432355

Renesas Electronics Corporation
Part No. HD6472355 HD6432353 HD6432355
Description 16-Bit Single-Chip Microcomputer
File Size 4,105.55K  /  880 Page

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Amphenol Communications Solutions
Part No. 69154-323LF
Description Dubox® 2.54mm, Board to Board Connector, PCB Mounted Receptacle, Through Mount, Double Entry, Double Row, 46 Position ,2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    K4S643232H-TC70 K4S643232H-TL70 K4S643232H-TC_L50 K4S643232H-TC_L55 K4S643232H-TC_L60 K4S643232H-TC_L70 K4S643232H-TC50

Samsung Electronic
SAMSUNG[Samsung semiconductor]
SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. K4S643232H-TC70 K4S643232H-TL70 K4S643232H-TC_L50 K4S643232H-TC_L55 K4S643232H-TC_L60 K4S643232H-TC_L70 K4S643232H-TC50 K4S643232H-TC55 K4S643232H-TC60 K4S643232H-TL50 K4S643232H-TL55 K4S643232H-TL60 K4S643232H-TC/L50 K4S643232H-TC/L55 K4S643232H-TC/L60 K4S643232H-TC/L70
Description 64Mb (512K x 32bit x 4 banks) SDRAM, LVTTL, 183MHz
64Mb (512K x 32bit x 4 banks) SDRAM, LVTTL, 166MHz
64Mb (512K x 32bit x 4 banks) SDRAM, LVTTL, 200MHz
   64Mb H-die (x32) SDRAM Specification
File Size 115.81K  /  12 Page

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Amphenol Communications Solutions
Part No. 10136646-04323LF
Description Minitek® Pwr 4.2, Single Row, Right Angle Through Hole Header, LCP, 15u\\ Gold (Tin on Tails) plating, Black Color, 4 Positions, GW Compatible, with Posts, Tray packing.
Tech specs 　 　

Official Product Page

For 4323-50MX50MM Found Datasheets File :: 115+       Page :: | 1 | 2 | 3 | 4 | 5 | <6> | 7 | 8 | 9 | 10 | 11 | 12 |   

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