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  460-3233 Datasheet PDF File

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    0541323362

Molex Electronics Ltd.
Part No. 0541323362
Description 0.50mm (.020) Pitch FFC/FPC Connector, Right Angle, SMT, ZIF, Bottom ContactStyle, 33 Circuits, 0.1μm (4μ) Gold (Au) Contact Plating
File Size 447.93K  /  6 Page

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Amphenol Communications Solutions
Part No. 86130142323385E1LF
Description 8613 M LF CNR
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
Samsung Electronic
Part No. K4M563233D
Description 8Mx32 Mobile SDRAM 90FBGA
File Size 63.67K  /  8 Page

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Amphenol Communications Solutions
Part No. 10131932-336ULF
Description Minitek®, Board to Board, Receptacle, Through Mount, Double row, 36 Positions, 2mm (0.079inch), horizontal.
Tech specs 　 　

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    Samsung Electronic
Part No. K4S283233F-M
Description 1M x 32Bit x 4 Banks SDRAM in 90 FBGA Data Sheet
File Size 67.05K  /  10 Page

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Amphenol Communications Solutions
Part No. 86130202323385E1LF
Description 8613 M LF CNR
Tech specs 　 　

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    Samsung Electronic
Part No. K4S643233E-SEN
Description 512K x 32Bit x 4 Banks Synchronous DRAM Data Sheet
File Size 70.19K  /  12 Page

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Amphenol Communications Solutions
Part No. 68683-233LF
Description Dubox®, Board To Board Connector, Receptacle, Vertical, Through Hole, Double Row, Top Entry, 66 Positions, 2.54mm (0.100in) Pitch
Tech specs 　 　

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    BDC Electronic
Part No. AX12/4009KS AX12/4609KS AX8/4619S AX12/4619KS
Description CYLINDRICAL INDUCTIVE SENSORS
File Size 515.38K  /  6 Page

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Amphenol Communications Solutions
Part No. 86130162323345E1LF
Description 8613 M CNR LF
Tech specs 　 　

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    K4S643233F-SE K4S643233F-DE K4S643233F-SE_P75 K4S643233F K4S643233F-DE_P1H K4S643233F-DE_P1L K4S643233F-DE_P75 K4S643233

SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
Samsung Electronic
Part No. K4S643233F-SE K4S643233F-DE K4S643233F-SE_P75 K4S643233F K4S643233F-DE_P1H K4S643233F-DE_P1L K4S643233F-DE_P75 K4S643233F-SE_I K4S643233F-SE_N K4S643233F-SE_P1H K4S643233F-SE_P1L K4S643233F-DE/P1H K4S643233F-DE/P1L K4S643233F-DE/P75 K4S643233F-SE/P1L K4S643233F-SE/P1H K4S643233F-SE/N K4S643233F-SE/I K4S643233F-SE/P75
Description Dual Low-Noise Precision Rail-To-Rail Operational Amplifier 14-SOIC
2Mx32 Mobile SDRAM 90FBGA CMOS SDRAM
From old datasheet system
File Size 61.65K  /  8 Page

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Amphenol Communications Solutions
Part No. 68023-233HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 33 Positions, 2.54mm Pitch, RightAngle, 3.42mm (0.135in) Mating, 7.75mm (0.305in) Tail.
Tech specs 　 　

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    Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
Samsung Electronic
Part No. K4S513233F-MC K4S513233F K4S513233F-F1H K4S513233F-F1L K4S513233F-F75 K4S513233F-L
Description Mobile SDRAM 移动SDRAM
File Size 140.34K  /  12 Page

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Amphenol Communications Solutions
Part No. 10131932-338ULF
Description Minitek®, Board to Board, Receptacle, Through Mount, Double row, 38 Positions, 2mm (0.079inch), horizontal.
Tech specs 　 　

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    MC13233C MC1323X MC13233CR2

Freescale Semiconductor, Inc
Part No. MC13233C MC1323X MC13233CR2
Description Low Cost SoC Remote Control Platform for the 2.4 GHz IEEE?
File Size 366.21K  /  36 Page

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Amphenol Communications Solutions
Part No. 86130102323355E1LF
Description 8613 M CNR LF
Tech specs 　 　

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    TSOP53236 TSOP53233 TSOP53238

Vishay Siliconix
Part No. TSOP53236 TSOP53233 TSOP53238
Description    IR Receiver Modules for Remote Control Systems
File Size 481.50K  /  22 Page

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Amphenol Communications Solutions
Part No. 10131932-334ULF
Description Minitek®, Board to Board, Receptacle, Through Mount, Double row, 34 Positions, 2mm (0.079inch), horizontal.
Tech specs 　 　

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    ADG3233BRJ-REEL ADG3233BRJ-REEL7

Analog Devices
Part No. ADG3233BRJ-REEL ADG3233BRJ-REEL7
Description Low Voltage 1.65 V to 3.6 V (Up/Down) Logic Level Translation Bypass Switch
File Size 256.43K  /  13 Page

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Amphenol Communications Solutions
Part No. 86130502323345E1LF
Description 8613 M CNR LF
Tech specs 　 　

Official Product Page

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