51163-1500 pdf Datasheet P6 Part Num --- IC-ON-LINE


	Part Number	Hot Search : CF5012 478M00 47101SC RD22EB3 XR1648 MAX4397 MTA50HDV SA200A
	Product Description
	Full Text Search

51163-1500 Datasheet PDF File

For 51163-1500 Found Datasheets File :: 150+ Page :: | 1 | 2 | 3 | 4 | 5 | <6> | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |

					Samsung semiconductor
Part No.	K4M51163PC-X
Description	8M x 16Bit x 4 Banks Mobile SDRAM
File Size	153.28K / 12 Page	View it Online	Download Datasheet

						Toshiba Electronic Devices & Storage Corporation
Part No.	ST1500GXH35A
Description	IEGT, 4500 V, 1500 A, 2-120B1S
Tech specs				Official Product Page

HUA FENG CIRCUIT

					Samsung semiconductor
Part No.	K4X51163PE-L
Description	32Mx16 Mobile DDR SDRAM
File Size	307.93K / 20 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54242-111500950LF
Description	BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 50 Positions, 2.54mm (0.100in) Pitch.
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	51163-0900 0511630900
Description	2.50mm (.098) Pitch Wire-to-Board Receptacle Housing, Positive Lock, With Retainer9 Circuits 2.50mm (.098") Pitch Wire-to-Board Receptacle Housing, Positive Lock, With Retainer9 Circuits
File Size	280.28K / 5 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	10118650-415004LF
Description	BergStik® 2.54mm, Board To Board Connector, Unshrouded Right Angle Header, Through Hole, Single row , Polarized, 15 Positions, 2.54mm (0.100in) Pitch.
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	0511630800 51163-0800
Description	2.50mm (.098) Pitch Wire-to-Board Receptacle Housing, Positive Lock, With Retainer8 Circuits 2.50mm (.098") Pitch Wire-to-Board Receptacle Housing, Positive Lock, With Retainer8 Circuits
File Size	280.27K / 5 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	10118615-215001LF
Description	BergStik®, Board to Board connector, Unshrouded vertical header ,Through Hole ,Single row , 15 Positions ,2.54mm (0.100in) Pitch.
Tech specs				Official Product Page

					Samsung Semiconductor Co., Ltd. SAMSUNG SEMICONDUCTOR CO. LTD. SAMSUNG[Samsung semiconductor] Samsung Electronic
Part No.	K4S511633F-YPC K4S511633F K4S511633F-F1H K4S511633F-F1L K4S511633F-F75 K4S511633F-L K4S511633F-YC
Description	8M x 16Bit x 4 Banks Mobile SDRAM 8米16 × 4银行移动SDRAM
File Size	111.06K / 12 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54112-807161500LF
Description	BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 16 Positions, 2.54mm (0.100in) Pitch.
Tech specs				Official Product Page

					Samsung Electronics
Part No.	K4X51163PG-FGC6 K4X51163PG-FGC8
Description	32Mx16 Mobile DDR SDRAM
File Size	364.01K / 23 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	51915-003LF
Description	PwrBlade®, Power Connectors, 10P 16S 3ACP Right Angle Receptacle, Solder To Board
Tech specs				Official Product Page

					Samsung Semiconductor
Part No.	K4H511638B-TC/LB3
Description	DDR Sdram 512Mb B-die
File Size	259.87K / 23 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	55715-001
Description	81 Position BGA Receptacle, 4mm Component Height, 1.27mm x 1.27mm Array
Tech specs				Official Product Page


Part No.	K4T51163QI-HIE70
Description	32M X 16 DDR DRAM, 0.4 ns, PBGA84
File Size	801.23K / 42 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	61082-101500LF
Description	BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 100 Positions.
Tech specs				Official Product Page


Part No.	K4T51163QE-ZPD50
Description	32M X 16 DDR DRAM, 0.5 ns, PBGA84
File Size	449.51K / 25 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	69150-033LF
Description	PV® Wire-to-Board Connector System, 2.54 x 2.54mm (0.1 x 0.1inch) Centerline Crimp-to-Wire PV Receptacle Shroud Assembly with Cable Tie Strain Relief, Double Row.
Tech specs				Official Product Page

					Samsung Semiconductor Co., Ltd. SAMSUNG SEMICONDUCTOR CO. LTD. SAMSUNG[Samsung semiconductor] Samsung Electronic
Part No.	K4S51163PF-YF K4S51163PF-F1L K4S51163PF-F90 K4S51163PF-Y K4S51163PF-YF750
Description	32M X 16 SYNCHRONOUS DRAM, 6 ns, PBGA54 FBGA-54 8M x 16Bit x 4 Banks Mobile-SDRAM 8米16 × 4银行移动SDRAM
File Size	110.82K / 12 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	U90A1115001
Description	ExpressPort QSFP+, High Speed Input Output Connectors, QSFP CAGE W ONE BARREL LP.
Tech specs				Official Product Page

For 51163-1500 Found Datasheets File :: 150+ Page :: | 1 | 2 | 3 | 4 | 5 | <6> | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |

▲Up To Search▲

Bom2Buy.com

Price and Availability

Price & Availability of 51163-1500

All Rights Reserved © IC-ON-LINE 2003 - 2022

[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy]

Mirror Sites : [www.datasheet.hk] [www.maxim4u.com] [www.ic-on-line.cn] [www.ic-on-line.com] [www.ic-on-line.net] [www.alldatasheet.com.cn] [www.gdcy.com] [www.gdcy.net]

. . . . .

We use cookies to deliver the best possible web experience and assist with our advertising efforts. By continuing to use this site, you consent to the use of cookies. For more information on cookies, please take a look at our Privacy Policy.

X

0.15733408927917