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  54101-F32-27-A03RLF Datasheet PDF File

For 54101-F32-27-A03RLF Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | <6> | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    RF3237

RF Micro Devices
Part No. RF3237
Description QUAD-BAND GSM

File Size 188.57K  /  2 Page

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Amphenol Communications Solutions

Part No. 54101-S0504A03RLF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 4 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    MRF323

Tyco Electronics
Part No. MRF323
Description RF POWER TRANSISTOR NPN SILICON

File Size 181.87K  /  5 Page

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Texas Instruments

Part No. 5962-9754101Q2A
Description Quadruple 2-Input Positive-NAND Buffers 20-LCCC -55 to 125
Tech specs    

Official Product Page

    BD-F326RD

BRIGHT LED ELECTRONICS CORP
Part No. BD-F326RD
Description super red chips, which are made from AlGaAs on GaAs substrate

File Size 148.47K  /  4 Page

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Texas Instruments

Part No. 5962-9754101QCA
Description Quadruple 2-Input Positive-NAND Buffers 14-CDIP -55 to 125
Tech specs    

Official Product Page

    BD-F322RD

BRIGHT LED ELECTRONICS CORP
Part No. BD-F322RD
Description green chips, which are made from GaP on GaP substrate

File Size 240.97K  /  3 Page

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Texas Instruments

Part No. 5962-9754101QDA
Description Quadruple 2-Input Positive-NAND Buffers 14-CFP -55 to 125
Tech specs    

Official Product Page

    CA-MLF32A-A-Z-T-01

Ironwood Electronics.
Part No. CA-MLF32A-A-Z-T-01
Description Carrier Adaptor 32 position MLF ZIF socket to 32 position surface mountable MLF emulator foot with test probes.

File Size 106.24K  /  2 Page

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Amphenol Communications Solutions

Part No. 54101-S08-16
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 16 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    Transpro Electronics
Part No. RF3200
Description RF3-xxx Series / 3 Amp Surface Mount Rectifier Flip-Chip

File Size 164.68K  /  2 Page

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Amphenol Communications Solutions

Part No. 54101-G34-02
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 2 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    Xilinx
Part No. XCF32P
Description (XCFxxS) Platform Flash In-System Programmable Configuration PROMs

File Size 340.98K  /  37 Page

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Amphenol Communications Solutions

Part No. 54101-G10-06LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 6 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    M/A-COM Technology Solu...
Part No. MRF321-15
Description The RF Line NPN Silicon Power Transistor

File Size 215.62K  /  5 Page

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Amphenol Communications Solutions

Part No. 54101-S08-04
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 4 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    MRF329

Motorola, Inc
Tyco Electronics
Part No. MRF329
Description BROADBAND RF POWER TRANSISTOR NPN SILICON

File Size 107.24K  /  6 Page

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Amphenol Communications Solutions

Part No. 54101-T10-02
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 2 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    MRF326

Motorola, Inc
Part No. MRF326
Description BROADBAND RF POWER TRANSISTOR NPN SILICON

File Size 107.84K  /  6 Page

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Amphenol Communications Solutions

Part No. 54101-G05-05
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 5 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

For 54101-F32-27-A03RLF Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | <6> | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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