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  70287-1011 Datasheet PDF File

For 70287-1011 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | <6> | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    0702871291

Molex Electronics Ltd.
Part No. 0702871291
Description 2.54mm (.100) Pitch C-Grid? Header, Breakaway, Dual Row, Vertical, with RetentionPin, 96 Circuits, 8.13mm (.320) Mating Pin Length, 0.76μm (30μ) Gold (Au) Selective

File Size 303.32K  /  5 Page

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Rochester Electronics LLC

Part No. BLA1011-300
Description BLA1011-300 - 300W LDMOS Avionics Power Transistor
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0702871210 70287-1210

Molex Electronics Ltd.
Part No. 0702871210 70287-1210
Description 2.54mm (.100) Pitch C-Grid? Header, Breakaway, Dual Row, Vertical, with RetentionPin, 32 Circuits, 6.10mm (.240) Mating Pin Length, 0.76μm (30μ) Gold (Au) Selective Plating
MOLEX Connector

File Size 308.51K  /  6 Page

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Amphenol Communications Solutions

Part No. 10114831-10115LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 15 POSITIONS, TIN PLATING
Tech specs    

Official Product Page

    0702871149

Molex Electronics Ltd.
Part No. 0702871149
Description 2.54mm (.100) Pitch C-Grid? Header, Breakaway, Dual Row, Vertical, with RetentionPin, 8 Circuits, 8.13mm (.320) Mating Pin Length, 0.38μm (15μ) Gold (Au) Selective

File Size 303.44K  /  5 Page

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Amphenol Communications Solutions

Part No. 10118085-101-10LF
Description Unshrouded Right Angle Header, Surface Mount With Peg, Double row , 10 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    70287-1239 0702871239

Molex Electronics Ltd.
Part No. 70287-1239 0702871239
Description 2.54mm (.100) Pitch C-Grid? Header, Breakaway, Dual Row, Vertical, with RetentionPin, 90 Circuits, 6.10mm (.240) Mating Pin Length, 0.76μm (30μ) Gold (Au) Selective

File Size 308.23K  /  6 Page

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Amphenol Communications Solutions

Part No. 10114831-10112LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 12 POSITIONS, TIN PLATING
Tech specs    

Official Product Page

    0702871211 70287-1211

Molex Electronics Ltd.
Part No. 0702871211 70287-1211
Description 2.54mm (.100) Pitch C-Grid? Header, Breakaway, Dual Row, Vertical, with RetentionPin, 34 Circuits, 6.10mm (.240) Mating Pin Length, 0.76μm (30μ) Gold (Au) Selective
2.54mm (.100") Pitch C-Grid垄莽 Header, Breakaway, Dual Row, Vertical, with RetentionPin, 34 Circuits, 6.10mm (.240") Mating Pin Length, 0.76楼矛m (30楼矛") Gold (Au)

File Size 308.51K  /  6 Page

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Amphenol Communications Solutions

Part No. 10114829-10113LF
Description 1.25mm Wire to Board Wafer, Vertical, Through Hole, 13 Positions
Tech specs    

Official Product Page

    0702871212 70287-1212

Molex Electronics Ltd.
Part No. 0702871212 70287-1212
Description 2.54mm (.100) Pitch C-Grid? Header, Breakaway, Dual Row, Vertical, with RetentionPin, 36 Circuits, 6.10mm (.240) Mating Pin Length, 0.76μm (30μ) Gold (Au) Selective
2.54mm (.100") Pitch C-Grid垄莽 Header, Breakaway, Dual Row, Vertical, with RetentionPin, 36 Circuits, 6.10mm (.240") Mating Pin Length, 0.76楼矛m (30楼矛") Gold (Au)

File Size 308.51K  /  6 Page

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Amphenol Communications Solutions

Part No. 10114828-10113LF
Description 1.25mm Wire to Board Wafer,Vertical, Surface Mount, 13 Positions
Tech specs    

Official Product Page

    0702871213 70287-1213

Molex Electronics Ltd.
Part No. 0702871213 70287-1213
Description 2.54mm (.100) Pitch C-Grid Header, Breakaway, Dual Row, Vertical, with Retention Pin, 38 Circuits
MOLEX Connector

File Size 308.51K  /  6 Page

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Amphenol Communications Solutions

Part No. 10114830-10113LF
Description 1.25mm Wire to Board Wafer, Right Angle, Surface Mount, 13 Positions
Tech specs    

Official Product Page

    0702871214 70287-1214

Molex Electronics Ltd.
Part No. 0702871214 70287-1214
Description 2.54mm (.100) Pitch C-Grid Header, Breakaway, Dual Row, Vertical, with Retention Pin, 40 Circuits
MOLEX Connector

File Size 308.50K  /  6 Page

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Amphenol Communications Solutions

Part No. 10114831-10111LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 11 POSITIONS, TIN PLATING
Tech specs    

Official Product Page

    0702871283

Molex Electronics Ltd.
Part No. 0702871283
Description 2.54mm (.100) Pitch C-Grid? Header, Breakaway, Dual Row, Vertical, with RetentionPin, 80 Circuits, 8.13mm (.320) Mating Pin Length, 0.76μm (30μ) Gold (Au) Selective

File Size 303.45K  /  5 Page

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Amphenol Communications Solutions

Part No. 10114830-10112LF
Description 1.25mm Wire to Board Wafer, Right Angle, Surface Mount, 12 Positions
Tech specs    

Official Product Page

    0702871267

Molex Electronics Ltd.
Part No. 0702871267
Description 2.54mm (.100) Pitch C-Grid Header, Breakaway, Dual Row, Vertical, with Retention Pin, 48 Circuits, 8.13mm

File Size 303.44K  /  5 Page

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Amphenol Communications Solutions

Part No. 10118085-101-12LF
Description Unshrouded Right Angle header,Surface Mount, Double Row, 12 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

For 70287-1011 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | <6> | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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