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Molex Electronics Ltd.
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| Part No. |
0015800169 15-80-0169 A-70567-0278
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| Description |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.38渭m (15渭) Gold, (Au) Selective Pla
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating
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| File Size |
1,218.39K /
7 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
10106268-0013101LF
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| Description |
PwrBlade+® , Power Connectors, 52S STB, Vertical, Receptacle.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
20021521-00130C4LF
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| Description |
Minitek127®, Shrouded Board to Board Header, Surface Mount, 30 positions, 1.27mm (0.500in) pitch.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10082378-10013TLF
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| Description |
PCI Express® GEN 3 Card Edge, Storage and Server Connector, Vertical, Press-Fit, x16, 164 Positions, 1.00mm (0.039in) Pitch
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
15-80-0101 70567-0003 A-70567-0003 0015800101
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, Tin (Sn) Plating
Molex Electronics Ltd.
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| File Size |
1,218.41K /
7 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
U92A110100131
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| Description |
MiniSAS HD, High Speed Input Output Connector, 1X1 HD MINISAS CAGE ASSY.
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
15-80-0129 0015800129 A-70567-0276
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, 0.38渭m (15渭) Gold, (Au) Selective Pla
Molex Electronics Ltd.
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| File Size |
1,218.57K /
7 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
10145226-0001311LF
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| Description |
DDR4 DIMM, Storage and Server Connector, Vertical , Through Hole, 288 Position , 0.85mm (0.033in) Pitch
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
15-80-0125 0015800125 70567-0140
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, 0.76渭m (30渭") Gold (Au) Selective Pla
Molex Electronics Ltd.
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| File Size |
1,218.47K /
7 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
65820-013LF
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| Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Right Angle Header, Through Hole, Double row , 26 Positions, 2.54mm (0.100in) Pitch.
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
15-80-0109 0015800109 70567-0275 A-70567-0275
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.38渭m (15渭) Gold, (Au) Selective Pla
Molex Electronics Ltd.
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| File Size |
1,218.56K /
7 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
68000-131HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 31 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 2.41 mm (0.095 in.) Tail
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
15-80-0107 0015800107 A-70567-0207
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, Tin (Sn) Plating
Molex Electronics Ltd.
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| File Size |
1,218.53K /
7 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
10069690-10013TLF
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| Description |
PCI Express® GEN 3 Card Edge, Storage and Server Connector, Straddle Mount, x16, 164 Positions, 1.00mm (0.039in) Pitch
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
A-70567-0363 15-80-1501 0015801501
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| Description |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 50 Circuits, 0.76渭m (30渭) Gold, (Au) Selective Pla
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 50 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating
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| File Size |
1,218.39K /
7 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
66900-130LF
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| Description |
Quickie Header, Wire to Board Connector, Standard Dual Beam - Double row - 30 Positions - 2.54 mm (0.1 in.) .
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
87900-132HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 32 Positions, 2.54 mm Pitch, Vertical, 18.29 mm (0.72in) Mating, 3.05 mm (0.12in) Tail.
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Official Product Page
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