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  73944-7217 Datasheet PDF File

For 73944-7217 Found Datasheets File :: 121+       Page :: | 1 | 2 | 3 | 4 | 5 | <6> | 7 | 8 | 9 | 10 | 11 | 12 | 13 |   

    73944-1200 0739441200

Molex Electronics Ltd.
Part No. 73944-1200 0739441200
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, SolderTail, Guide Pin Option, 144 Circuits

File Size 154.07K  /  4 Page

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Amphenol Communications Solutions

Part No. 73944-2002LF
Description Metral® Board Connectors, Backplane Connectors, Signal Receptacle, Right Angle, Press Fit, 5 Rows, 210 Positions.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0739440216

Molex Electronics Ltd.
Part No. 0739440216
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, SolderTail, Guide Pin Option, 72 Circuits

File Size 154.07K  /  4 Page

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Amphenol Communications Solutions

Part No. 73944-1003LF
Description Metral® Board Connectors, Backplane Connectors, Signal Receptacle, Right Angle, Through Hole, 5 Rows, 210 Positions.
Tech specs    

Official Product Page

   
Part No. 0739440217
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, SolderTail, Guide Pin Option, 72 Circuits

File Size 154.07K  /  4 Page

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Amphenol Communications Solutions

Part No. 73944-1002LF
Description Metral® Board Connectors, Backplane Connectors, Signal Receptacle, Right Angle, Press Fit, 5 Rows, 210 Positions.
Tech specs    

Official Product Page

    0739441217

Molex Electronics Ltd.
Part No. 0739441217
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, SolderTail, Guide Pin Option, 144 Circuits

File Size 154.07K  /  4 Page

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Amphenol Communications Solutions

Part No. 47217-000LF
Description PV® Wire-to-Board Connector System, 2.54mm Pitch, Wire to Board, Crimp-to-Wire Receptacle.
Tech specs    

Official Product Page

    0739441016

Molex Electronics Ltd.
Part No. 0739441016
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, SolderTail, Guide Pin Option, 144 Circuits

File Size 154.07K  /  4 Page

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Amphenol Communications Solutions

Part No. 54122-109721750LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 72 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    0739441216

Molex Electronics Ltd.
Part No. 0739441216
Description 2.00mm (.079) Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Solder Tail, Guide Pin Option, 144 Circuits

File Size 154.07K  /  4 Page

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Amphenol Communications Solutions

Part No. 68739-444HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 44 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    0739441009

Molex Electronics Ltd.
Part No. 0739441009
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, SolderTail, Guide Pin Option, 144 Circuits

File Size 153.82K  /  4 Page

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Amphenol Communications Solutions

Part No. 68739-448HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 48 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    0739441005

Molex Electronics Ltd.
Part No. 0739441005
Description 2.00mm (.079) Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Solder Tail, Guide Pin Option

File Size 153.82K  /  4 Page

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Amphenol Communications Solutions

Part No. 68739-446HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 46 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    0739447005

Molex Electronics Ltd.
Part No. 0739447005
Description 2.00mm (.079) Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Solder Tail, Guide Pin Option, 144 Circuits

File Size 153.83K  /  4 Page

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Amphenol Communications Solutions

Part No. 68739-442HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 42 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    0739447000

Molex Electronics Ltd.
Part No. 0739447000
Description 2.00mm (.079) Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Solder Tail, Guide Pin Option, 144 Circuits

File Size 154.08K  /  4 Page

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Amphenol Communications Solutions

Part No. 68739-440HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 40 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

For 73944-7217 Found Datasheets File :: 121+       Page :: | 1 | 2 | 3 | 4 | 5 | <6> | 7 | 8 | 9 | 10 | 11 | 12 | 13 |   

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