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  87832-3414 Datasheet PDF File

For 87832-3414 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | <6> | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    87832-2221

Molex Electronics Ltd.
Part No. 87832-2221
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, Shrouded, Leadfree 22 Circuits, 0.76μm (30μ) Gold (Au) Plating
File Size 386.31K  /  6 Page

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Amphenol Communications Solutions
Part No. 76341-425LF
Description Dubox® 2.54mm, Board to Board Connector, PCB mounted Receptacle, Vertical, Through Hole, Top Entry, Single row , 25 Positions, 2.54mm (0.100in) Pitch
Tech specs 　 　

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HUA FENG CIRCUIT





    87832-2220

Molex Electronics Ltd.
Part No. 87832-2220
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, Shrouded, Leadfree 22 Circuits, 0.38μm (15μ) Gold (Au) Plating
File Size 367.52K  /  6 Page

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Amphenol Communications Solutions
Part No. 76341-417LF
Description Dubox® 2.54mm, Board to Board Connector, PCB mounted Receptacle, Vertical, Through Hole, Top Entry, Single row , 17 Positions, 2.54mm (0.100in) Pitch
Tech specs 　 　

Official Product Page

    87832-1622

Molex Electronics Ltd.
Part No. 87832-1622
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, Shrouded, Leadfree, 16 Circuits, 0.38μm (15μ) Gold (Au) Plating, Pick-and-Place Cap
File Size 367.60K  /  6 Page

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Amphenol Communications Solutions
Part No. 69173-414HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 14 Positions, 2.54 mm Pitch, Vertical, 7.49 mm (0.295 in.) Mating, 3.42 mm (0.135 in.) Tail
Tech specs 　 　

Official Product Page

    87832-1014

Molex Electronics Ltd.
Part No. 87832-1014
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, Shrouded, Leadfree 10 Circuits, 0.38μm (15μ) Gold (Au) Plating, without Locking Window
File Size 345.43K  /  5 Page

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Amphenol Communications Solutions
Part No. 76341-414LF
Description Dubox® 2.54mm, Board to Board Connector, PCB mounted Receptacle, Vertical, Through Hole, Top Entry, Single row , 14 Positions, 2.54mm (0.100in) Pitch
Tech specs 　 　

Official Product Page

    87832-1816

Molex Electronics Ltd.
Part No. 87832-1816
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, Shrouded, Leadfree 18 Circuits, 0.38μm (15μ) Gold (Au) Plating, with Locking Windows
File Size 345.92K  /  5 Page

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Amphenol Communications Solutions
Part No. 131-3414-21H
Description Paladin® 112Gb/s Backplane Connector, 3-Pair, 4 Column, Right End Wall, Backplane Module, 2.25mm Wipe, APP.
Tech specs 　 　

Official Product Page

    87832-1814

Molex Electronics Ltd.
Part No. 87832-1814
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, Shrouded, Leadfree, 18 Circuits, 0.38μm (15μ) Gold (Au) Plating, with Locking Windows
File Size 345.93K  /  5 Page

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Amphenol Communications Solutions
Part No. 76341-415LF
Description Dubox® 2.54mm, Board to Board Connector, PCB mounted Receptacle, Vertical, Through Hole, Top Entry, Single row , 15 Positions, 2.54mm (0.100in) Pitch
Tech specs 　 　

Official Product Page

    87832-6923

Molex Electronics Ltd.
Part No. 87832-6923
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, Shrouded, Leadfree 40 Circuits, 0.76μm (30μ) Gold (Au) Plating, with Pick-and-Place Cap
File Size 386.24K  /  6 Page

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Amphenol Communications Solutions
Part No. 92634-142HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 42 Positions, 2.54 mm Pitch, Right Angle, 8.08 mm (0.318in) Mating, 8.08 mm (0.318in) Tail.
Tech specs 　 　

Official Product Page

    87832-3421

Molex Electronics Ltd.
Part No. 87832-3421
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, Shrouded, Leadfree 34 Circuits, 0.76μm (30μ) Gold (Au) Plating
File Size 386.31K  /  6 Page

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Amphenol Communications Solutions
Part No. 68653-414HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 14 Positions, 2.54mm Pitch, Vertical, 13.72mm (0.54in) Mating, 2.41mm (0.095in) Tail.
Tech specs 　 　

Official Product Page

    87832-5522

Molex Electronics Ltd.
Part No. 87832-5522
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, Shrouded, Leadfree, 12 Circuits, 0.38μm (15μ) Gold (Au) Plating, with Pick-and-Place Cap
File Size 367.66K  /  6 Page

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Amphenol Communications Solutions
Part No. 76341-424LF
Description Dubox® 2.54mm, Board to Board Connector, PCB mounted Receptacle, Vertical, Through Hole, Top Entry, Single row , 24 Positions, 2.54mm (0.100in) Pitch
Tech specs 　 　

Official Product Page

    87832-4423

Molex Electronics Ltd.
Part No. 87832-4423
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, Shrouded, Leadfree 44 Circuits, 0.76μm (30μ) Gold (Au) Plating, Pick-and-Place Cap
File Size 386.40K  /  6 Page

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Amphenol Communications Solutions
Part No. 131-3414-21D
Description Paladin® 112Gb/s Backplane Connector, 3-Pair, 4 Column, Right End Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs 　 　

Official Product Page

For 87832-3414 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | <6> | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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