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飞思卡尔半导体(中国)有限公司
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| Part No. |
MRF18090BSR3
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| OCR Text |
... 5.08 d 0.495 0.505 12.57 12.83 e 0.035 0.045 0.89 1.14 f 0.003 0.006 0.08 0.15 g 1.100 bsc 27.94 bsc h 0.057 0.067 1.45 1.70 k 0.175 0.205 4.44 5.21 n 0.871 0.889 19.30 22.60 q .118 .138 3.00 3.51 r 0.515 0.525 13.10 13.30 style 1: pin 1. ... |
| Description |
RF Power Field Effect Transistors N-Channel Enhancement-Mode Lateral MOSFETs 射频功率场效应晶体管N沟道增强型MOSFET的外
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| File Size |
385.00K /
8 Page |
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it Online |
Download Datasheet
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IXYS
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| Part No. |
IXFN280N085
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| OCR Text |
...ar ar ar ar t c = 25 c 200 a e e e e e ar ar ar ar ar t c = 25 c64mj e e e e e as as as as as t c = 25 c4j dv/dt dv/dt dv/dt dv/dt dv/dt i s i dm , di/dt 100 a/ s, v dd v dss , 5 v/ns t j 150 c, r g = 2 ? ... |
| Description |
Discrete MOSFETs: HiPerFET Power MOSFETS
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| File Size |
139.85K /
2 Page |
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it Online |
Download Datasheet |
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NXP Semiconductors N.V.
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| Part No. |
BGF802-20
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| OCR Text |
...om dow corning trans-heat from e. friis-mikkelsen. the use of thermal pads instead of thermal compound is not recommended as the pads may not maintain a uniform flatness over a period of time. mounting p reparation ensure that the surface ... |
| Description |
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| File Size |
96.56K /
12 Page |
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it Online |
Download Datasheet |
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Price and Availability
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