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Agilent (Hewlett-Packard)
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| Part No. |
HDMP-3001 HDMP-3001K
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| Description |
Telecommunication IC
HDMP-3001K · Evaluation Board for Multi-Protocol IC (MPIC) Ethernet Over SONET/SDH (EOS) Mapper
HDMP-3001 · Multi-Protocol IC (MPIC) Ethernet Over SONET/SDH (EOS) Mapper: Fast Ethernet to OC-3
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| File Size |
51.13K /
2 Page |
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it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
61082-104506LF
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| Description |
BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 100 Positions.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
61082-204506LF
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| Description |
BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 200 Positions.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
67045-008LF
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| Description |
Quickie®, Wire To Board, Strain Relief, 8 Positions
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
67045-050LF
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| Description |
Quickie®, Wire To Board, Strain Relief, 50 Positions
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
RJE398880450
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| Description |
Modular Jack - Right Angle, Input Output Connectors, 8P8C, Without Shield, With LEDs.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54112-804500800LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 50 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Agilent (Hewlett-Packard)
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| Part No. |
HDMP-2630B HDMP-2631B
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| Description |
HDMP-2630B · 1.0625-2.125 GBd Serdes Circuits for Fibre Channel/Storage Applications: SSTL_2
HDMP-2631B · 1.0625-2.125 GBd Serdes Circuits for Fibre Channel/Storage Applications: SSTL_3
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| File Size |
302.99K /
23 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
86840-450HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 50 Positions, 2.54 mm Pitch, Right Angle, 8.08 mm (0.318in) Mating, 5.84 mm (0.23in) Tail.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
20021831-04508T1LF
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| Description |
Minitek127®, Board to Board Stacking Header , Surface Mount, Double Row, 08 positions, 1.27mm (0.500in) pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54242-104500950LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 50 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Agilent (Hewlett-Packard)
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| Part No. |
HDMP-1536A HDMP-1546A
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| Description |
Fibre Channel Transceiver Chip(光纤通道收发器芯
HDMP-1536A · 1.0625 GBd Fibre Channel 10x10 mm QFP Transceiver Chip (Recommend HDMP-1636A for new designs)
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| File Size |
242.22K /
16 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
67045-018LF
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| Description |
Quickie®, Wire To Board, Strain Relief, 18 Positions
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| Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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JITONG
TECHNOLOGY
(CHINA HK & SZ)
Datasheet.hk's Sponsor |
| Part: HDMP-0450 |
| Maker: AGILENT |
| Pack: QFP |
| Stock: 316 |
| Unit price
for : |
|
50: $7.66 |
|
100: $7.28 |
| 1000:
$6.90 |
|
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