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  INIC-1611 Datasheet PDF File

For INIC-1611 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | <6> | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

   
Part No. 23C1611
Description From old datasheet system

File Size 104.08K  /  7 Page

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Amphenol Communications Solutions

Part No. 131-6116-11H
Description Paladin® 112Gb/s Backplane Connector, 6-Pair, 6 Column, Open Wall, Backplane Module, 1.5mm Wipe, APP.
Tech specs    

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HUA FENG CIRCUIT





   
Part No. 23L1611
Description From old datasheet system

File Size 57.01K  /  7 Page

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Amphenol Communications Solutions

Part No. 131-6116-11D
Description Paladin® 112Gb/s Backplane Connector, 6-Pair, 6 Column, Open Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    Samsung Semiconductor Co., Ltd.
Part No. KS16116-02
Description 9600 bps FAX MODEM(9600bps传真调制解调 9600 bps的传真调制解调器9600bps的传真调制解调器

File Size 25.32K  /  3 Page

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Part No. 20021611-00012T1LF
Description 1.27mm (0.05in.) pitch, Header with eject latch, 12 contacts
Tech specs    

Official Product Page

   
Part No. 29L1611
Description From old datasheet system

File Size 208.82K  /  36 Page

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Part No. 20021611-00030T1LF
Description 1.27mm (0.05in.) pitch, Header with eject latch, 30 contacts
Tech specs    

Official Product Page

   
Part No. UC1611J
Description SILICON, RECTIFIER DIODE

File Size 209.53K  /  6 Page

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Part No. 87916-113HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 13 Positions, 2.54mm Pitch, Vertical, 21.08mm (0.83in) Mating, 3.25mm (0.128in) Tail.
Tech specs    

Official Product Page

   
Part No. 2SK1611
Description

File Size 327.98K  /  4 Page

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Amphenol Communications Solutions

Part No. 20021611-00040T8LF
Description 1.27mm (0.05in.) pitch, Header with eject latch, 40 contacts
Tech specs    

Official Product Page

    ShenZhen FreesCale Electronics. Co., Ltd
Part No. AON1611
Description 20V P-Channel MOSFET

File Size 252.26K  /  5 Page

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Part No. 87916-111HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 11 Positions, 2.54mm Pitch, Vertical, 21.08mm (0.83in) Mating, 3.25mm (0.128in) Tail.
Tech specs    

Official Product Page

    TY Semiconductor Co., Ltd
Part No. 2SD1611
Description High forward current transfer ratio hFE High collector-base voltage (Emitter open) VCBO

File Size 107.98K  /  2 Page

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Part No. 20021611-00008T1LF
Description 1.27mm (0.05in.) pitch, Header with eject latch, 8 contacts
Tech specs    

Official Product Page

    2SA1611

SeCoS Halbleitertechnologie GmbH
Part No. 2SA1611
Description PNP Silicon Plastic Encapsulated Transistor

File Size 105.89K  /  1 Page

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Part No. U90H161100A
Description ExpressPort QSFP+, High Speed Input Output Connectors, QSFP 12.73MM HS 1X1.
Tech specs    

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    SHENZHEN YONGERJIA INDUSTRY CO.,LTD
Part No. 2SA1611
Description TRANSISTOR (PNP)

File Size 136.33K  /  2 Page

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Amphenol Communications Solutions

Part No. 131-3516-11D
Description Paladin® 112Gb/s Backplane Connector, 3-Pair, 6 Column, Left Polarized, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

For INIC-1611 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | <6> | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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