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  sapphire Datasheet PDF File

For sapphire Found Datasheets File :: 515    Search Time::1.985ms    
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    HCS373KTR HCS373T HCS373DTR

Intersil, Corp.
Intersil Corporation
Part No. HCS373KTR HCS373T HCS373DTR
OCR Text ... POTENTIAL: Unbiased Silicon on sapphire BACKSIDE FINISH: sapphire PASSIVATION: Type: Silox (SiO2) Thickness: 13kA 2.6kA WORST CASE CURRENT DENSITY: < 2.0e5 A/cm2 TRANSISTOR COUNT: 376 PROCESS: CMOS SOS Metallization Mask Layout HCS373T...
Description Radiation Hardened Octal Transparent Latch, Three-State HC/UH SERIES, 8-BIT DRIVER, TRUE OUTPUT, CDIP20
Radiation Hardened Octal Transparent Latch/ Three-State

File Size 95.90K  /  3 Page

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    5962R9573101TRC 5962R9573101TXC HCS244DTR HCS244KTR HCS244T

Intersil Corporation
Part No. 5962R9573101TRC 5962R9573101TXC HCS244DTR HCS244KTR HCS244T
OCR Text ... POTENTIAL: Unbiased Silicon on sapphire BACKSIDE FINISH: sapphire PASSIVATION: Type: Silox (SiO2) Thickness: 13.0kA 2.6kA WORST CASE CURRENT DENSITY: < 2.0e5 A/cm2 TRANSISTOR COUNT: 224 PROCESS: CMOS SOS Metallization Mask Layout HCS24...
Description Radiation Hardened Octal Buffer/Line Driver, Three-State(抗辐射八缓冲线驱动器(三态))
Radiation Hardened Octal Buffer/Line Driver, Three-State
Radiation Hardened Octal Buffer/Line Driver/ Three-State

File Size 94.65K  /  3 Page

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    5962R9672602TRC 5962R9672602TXC ACTS541KTR-02 ACTS541T ACTS541DTR-02

Intersil Corporation
Part No. 5962R9672602TRC 5962R9672602TXC ACTS541KTR-02 ACTS541T ACTS541DTR-02
OCR Text ...POTENTIAL: Unbiased (Silicon on sapphire) Bond Pad #20 (VCC) First BACKSIDE FINISH: sapphire PASSIVATION: Type: Silox (SiO2) Thickness: 8.0kA 1.0kA WORST CASE CURRENT DENSITY: < 2.0e5 A/cm2 TRANSISTOR COUNT: 182 PROCESS: CMOS SOS Metalli...
Description Radiation Hardened Octal Three-State Buffer/Line Driver
Inductor Kit;Contents Of Kit:Inductors; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):Yes; For Use With:CM Series; Series:CM201212 RoHS Compliant: Yes

File Size 57.60K  /  3 Page

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    5962R9672502TRC 5962R9672502TXC ACTS573DTR-02 ACTS573KTR-02 ACTS573T

Intersil Corporation
Intersil, Corp.
Part No. 5962R9672502TRC 5962R9672502TXC ACTS573DTR-02 ACTS573KTR-02 ACTS573T
OCR Text ...POTENTIAL: Unbiased (Silicon on sapphire) Bond Pad #20 First BACKSIDE FINISH: sapphire PASSIVATION: Type: Silox (SiO2) Thickness: 8kA 1kA WORST CASE CURRENT DENSITY: < 2.0e5 A/cm2 TRANSISTOR COUNT: 190 PROCESS: CMOS SOS Metallization Mas...
Description Radiation Hardened Octal Three-State Transparent Latch ACT SERIES, 8-BIT DRIVER, TRUE OUTPUT, CDIP20
Radiation Hardened Octal Three-State Transparent Latch ACT SERIES, 8-BIT DRIVER, TRUE OUTPUT, CDFP20

File Size 40.18K  /  3 Page

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    5962R9671901TXC ACTS245DTR 5962R9671901TRC ACTS245KTR ACTS245T

Intersil Corporation
Part No. 5962R9671901TXC ACTS245DTR 5962R9671901TRC ACTS245KTR ACTS245T
OCR Text ...POTENTIAL: Unbiased (Silicon on sapphire) Bond Pad #20 (VCC) First Bond Pad #20 (VCC) Uses Two Bond Wires Bond Pad #10 (GND) Uses Two Bond Wires BACKSIDE FINISH: sapphire PASSIVATION: Type: Silox (SiO2) Thickness: 8.0kA 1.0kA WORST CASE CUR...
Description Radiation Hardened Octal Non-Inverting Bidirectional Bus Transceiver(抗辐射八双向总线收发
Radiation Hardened Octal Non-Inverting Bidirectional Bus Transceiver

File Size 79.06K  /  3 Page

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    5962R9572701TXC 5962R9572701TEC HCS138KTR HCS138DTR HCS138T

Intersil Corporation
http://
Intersil, Corp.
Part No. 5962R9572701TXC 5962R9572701TEC HCS138KTR HCS138DTR HCS138T
OCR Text ... POTENTIAL: Unbiased Silicon on sapphire BACKSIDE FINISH: sapphire PASSIVATION: Type: Silox (SiO2) Thickness: 13.0kA 2.6kA WORST CASE CURRENT DENSITY: < 2.0e5 A/cm2 TRANSISTOR COUNT: 264 PROCESS: CMOS SOS Metallization Mask Layout HCS13...
Description Radiation Hardened Inverting 3-to-8 Line Decoder/Demultiplexer HC/UH SERIES, OTHER DECODER/DRIVER, INVERTED OUTPUT, CDFP16

File Size 158.24K  /  3 Page

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    5962R9671701TXC 5962R9671701TRC ACTS240DTR ACTS240KTR ACTS240T

Intersil Corporation
Part No. 5962R9671701TXC 5962R9671701TRC ACTS240DTR ACTS240KTR ACTS240T
OCR Text ...POTENTIAL: Unbiased (Silicon on sapphire) Bond Pad #20 (VCC) First Bond Pad #10 (Gnd) Uses Two Bond Wires Bond Pad #20 (VCC) Uses Two Bond Wires BACKSIDE FINISH: sapphire PASSIVATION: Type: Silox (SiO2) Thickness: 8.0kA 1.0kA WORST CASE CUR...
Description High Reliability, Radiation Hardened Octal Buffer/Line Driver, Three-State, Inverting(抗辐射高稳定性能的八缓冲线驱动器(三态,反相
High Reliability, Radiation Hardened Octal Buffer/Line Driver, Three-State, Inverting
High Reliability/ Radiation Hardened Octal Buffer/Line Driver/ Three-State/ Inverting

File Size 50.33K  /  3 Page

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    Hamamatsu Photonics
Part No. S9970 S9971-1008 S9971-0906 S9971-1006 S9970-1008 S9970-0906
OCR Text ...ies: quartz glass s9971 series: sapphire glass *1: temporary window type (ex. s9970-0906n) and uv coa t type (ex. s 9970-0906uv) are available upon request. (temporary window is fixed by tape to protec t the ccd chip and wire bonding.) 1 ...
Description CCD area image sensor Low dark signal ・ low readout noise/front-illuminated FFT-CCD

File Size 289.03K  /  10 Page

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    Hamamatsu Photonics
Part No. S8665-0909
OCR Text ....0 pin no. 1 1st pin index mark sapphire window 7.0 5.0 pinched off tube 2.54 0.46 27.94 kmpda0142eb kmpdb0058ea " #! #$ ' 82 5 5 9 ...
Description CCD area image sensor Four-stage thermoelectric cooled, back-thinned FFT-CCD

File Size 173.94K  /  9 Page

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    MT5300-UG

Marktech Corporate
Part No. MT5300-UG
OCR Text ...e green lamp is made with InGaN/sapphire chip and water clear epoxy resin. 0.5 MAX. A 1.5 TYP. K Notes: 1. All dimensions are in mm. 2. Tolerance is 0.25mm unless otherwise noted. Description LED Chip Part No. Material M...
Description    5.0mm ROUND LED LAMP

File Size 152.50K  /  6 Page

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