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  3236 Datasheet PDF File

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    SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. K7R321884M K7R323684M K7R323684M-FC16 K7R321884M-FC16
Description 1Mx36 & 2Mx18 QDRTM II b4 SRAM

File Size 197.54K  /  18 Page

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Amphenol Communications Solutions

Part No. 94063-236HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    K7P321874C K7P323674C K7P323674C-HC300

Samsung semiconductor
Part No. K7P321874C K7P323674C K7P323674C-HC300
Description 1Mx36 & 2Mx18 SRAM
1M X 36 LATE-WRITE SRAM, 1.6 ns, PBGA119

File Size 450.39K  /  15 Page

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Amphenol Communications Solutions

Part No. 68033-236HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 36 Positions, 2.54 mm Pitch, Vertical, 3.42 mm (0.135in) Mating, 12.01 mm (0.473in) Tail.
Tech specs    

Official Product Page

    3229 7687 3060 3064 3062 3061 3065 3066 3069 3230 340 4711 4713 9600 3059 3052 4687 4688 4689 3105 7680 7681 9602 4341 3

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Part No. 3229 7687 3060 3064 3062 3061 3065 3066 3069 3230 340 4711 4713 9600 3059 3052 4687 4688 4689 3105 7680 7681 9602 4341 3053 3057 3238 3058 3110 3236 3234 3055
Description WASHERS AND NUTS

File Size 80.18K  /  2 Page

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Amphenol Communications Solutions

Part No. 75160-132-36LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, through hole, single Row,36 position, 2.54mm pitch
Tech specs    

Official Product Page

    K7K3236U2C K7K3218U2C-EC330 K7K3218U2C-FC330

Samsung semiconductor
Maxim Integrated Products, Inc.
Part No. K7K3236U2C K7K3218U2C-EC330 K7K3218U2C-FC330
Description 1Mx36 & 2Mx18 DDRII CIO b2 SRAM
DDR SRAM, PBGA165 15 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-165

File Size 401.35K  /  19 Page

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Amphenol Communications Solutions

Part No. 77311-132-36LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 36 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    K7M321835C-PC65 K7M321835C-PI65 K7M321835C-QC65 K7M321835C-QI65 K7M323635C K7M323635C-PC65 K7M323635C-PI65 K7M323635C-QC

Samsung semiconductor
Part No. K7M321835C-PC65 K7M321835C-PI65 K7M321835C-QC65 K7M321835C-QI65 K7M323635C K7M323635C-PC65 K7M323635C-PI65 K7M323635C-QC65 K7M323635C-QI65
Description 1Mx36 & 2Mx18 Flow-Through NtRAM

File Size 386.74K  /  19 Page

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Amphenol Communications Solutions

Part No. 65863-236LF
Description Quickie Header, Wire to Board Connector, Double Row, 50 Positions, 2.54 mm (0.1 in.), Vertical, Eject Latch Header 0.76 um (30 u\\.) Gold Mating Plating.
Tech specs    

Official Product Page

    SAMSUNG SEMICONDUCTOR CO. LTD.
Samsung Semiconductor Co., Ltd.
Part No. K7A321830C K7A323630C K7A321830C-PC20 K7A323630C-PC20 K7A321830C-QC20 K7A321830C-PI20 K7A321830C-QI20 K7A323630C-PI20 K7A323630C-QC20 K7A323630C-QI20
Description 1Mx36 and 2Mx18 Synchronous SRAM 1Mx36Mx18同步SRAM

File Size 428.57K  /  19 Page

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Amphenol Communications Solutions

Part No. 10131933-236ULF
Description Minitek®, Board to Board, Receptacle, Surface Mount, Double row, 36 Positions, 2mm (0.079inch), horizontal.
Tech specs    

Official Product Page

    SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. K7B321825M K7B323625M K7B323625M-QC6575
Description Aluminum Snap-In Capacitor; Capacitance: 820uF; Voltage: 250V; Case Size: 22x50 mm; Packaging: Bulk
1Mx36 & 2Mx18 Synchronous SRAM
1Mx36 & 2Mx18 Synchronous SRAM

File Size 266.77K  /  19 Page

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Amphenol Communications Solutions

Part No. 85833-236LF
Description Metral® Board Connectors, Backplane Connectors, 5 Row Signal Header, Straight, Press-Fit, Wide body, 4 Mod.
Tech specs    

Official Product Page

    OKI[OKI electronic componets]
Part No. MSC23236DL-XXDS20 MSC23236D MSC23236D-60BS20 MSC23236D-60DS20 MSC23236D-70BS20 MSC23236DL-60BS20 MSC23236DL-60DS20 MSC23236DL-70BS20 MSC23236DL-70DS20 MSC23236D-XXBS20
Description 2,097,152-word x 36-bit DYNAMIC RAM MODULE : FAST PAGE MODE TYPE

File Size 81.62K  /  9 Page

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Amphenol Communications Solutions

Part No. 68653-236HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    SAMSUNG SEMICONDUCTOR CO. LTD.
Samsung Semiconductor Co., Ltd.
Part No. K7D321874A-HC37 K7D323674A-HC33 K7D323674A-HC40 K7D321874A-HC33 K7D323674A-HC37 K7D321874A-HC40 K7D321874A-HGC37 K7D323674A-HGC37
Description 32Mb A-die DDR SRAM Specification 32兆甲芯片的DDR SRAM的规

File Size 487.24K  /  19 Page

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Amphenol Communications Solutions

Part No. 68023-236HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Right Angled Header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    K7A323630C K7A321830C K7A321830C-PC20 K7A321830C-PI20 K7A321830C-QC20 K7A321830C-QI20 K7A323630C-PC20 K7A323630C-QI20 K7

SAMSUNG[Samsung semiconductor]
Part No. K7A323630C K7A321830C K7A321830C-PC20 K7A321830C-PI20 K7A321830C-QC20 K7A321830C-QI20 K7A323630C-PC20 K7A323630C-QI20 K7A323630C-PI20 K7A323630C-QC20 K7A323630C-QC200
Description 1M X 36 CACHE SRAM, 3.1 ns, PQFP100
1Mx36 and 2Mx18 Synchronous SRAM

File Size 421.50K  /  19 Page

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Amphenol Communications Solutions

Part No. 68683-236LF
Description Dubox®, Board To Board Connector, Receptacle, Vertical, Through Hole, Double Row, Top Entry, 72 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

For 3236 Found Datasheets File :: 138+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | <7> | 8 | 9 | 10 | 11 | 12 | 13 | 14 |   

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