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Amphenol Communications Solutions |
| Part No. |
86303426LF
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| Description |
86303426LF-F LL 50P LF
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
F3321A7F121050E200
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| Description |
Flex Connector, P=0.50mm, H=2.45mm, Right angle orientation,ZIF,AUTOLOCK,50P
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54112-803080900LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 8 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54112-801300800LF
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| Description |
BERGSTIK STACKING
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| Tech specs |
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Official Product Page
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JAPAN AVIATION ELECTRONICS INDUSTRY LTD
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| Part No. |
WR-50P-VF-1 WR-20P-VF-1
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| Description |
50 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SURFACE MOUNT
20 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SURFACE MOUNT
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| File Size |
67.77K /
2 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
54112-807161500LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 16 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0309681128 30968-1128
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| Description |
2.54mm (.100) Pitch, 0.64mm (.025) Width H-DAC 64 High Density AutomotiveCrimp Housing, Dual Row, 12 Circuits, Polarization Option #2, Black
2.54mm (.100) Pitch, 0.64mm (.025) Width H-DAC 64?/a> High Density AutomotiveCrimp Housing, Dual Row, 12 Circuits, Polarization Option #2, Black
2.54mm (.100") Pitch, 0.64mm (.025") Width H-DAC 64垄芒 High Density AutomotiveCrimp Housing, Dual Row, 12 Circuits, Polarization Option #2, Black
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| File Size |
301.14K /
3 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
54112-811121900LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 12 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
78511-128HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 28 Positions, 2.54 mm Pitch.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0901301128 90130-1128
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| Description |
2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 28 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 28 Circuits, Black, 3楼矛m (118楼矛) Tin (Sn) over Nickel (Ni)
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| File Size |
585.88K /
7 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
54112-807361000LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 36 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87911-2811 0879112811
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, 28 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tube Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Right Angle, Through Hole, 28 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating, Tube Packaging, Lead-free
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| File Size |
360.88K /
6 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
54112-812262450LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 26 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
94611-128HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 28 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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