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  5133 Datasheet PDF File

For 5133 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | <7> | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    0513361310 51336-1310

Molex Electronics Ltd.
Part No. 0513361310 51336-1310
Description 1.25mm (.049) Pitch Mini Mi II System Wire-to-Board IDT Housing, Single Row, 13Circuits
1.25mm (.049") Pitch Mini Mi II垄芒 System Wire-to-Board IDT Housing, Single Row, 13Circuits
MOLEX Connector

File Size 99.07K  /  2 Page

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Amphenol Communications Solutions

Part No. 87185-133HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 33 Positions, 2.54 mm Pitch, Vertical, 26.49 mm (1.043in) Mating, 2.41 mm (0.095in) Tail.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0513381074

Molex Electronics Ltd.
Part No. 0513381074
Description 0.40mm (.016) Pitch Board-to-Board SlimStack?/a> Receptacle, Surface Mount, DualLeads, 100 Circuits, Lead-free
MOLEX Connector

File Size 509.66K  /  8 Page

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Amphenol Communications Solutions

Part No. 98426-G04-05-133LF
Description Minitek® 2.00mm, Board to Board, Shrouded Vertical Stacking Header, Through Hole, Double Row, 10 Positions, 2.00mm (0.079in) Pitch.
Tech specs    

Official Product Page

    0513361410 51336-1410

Molex Electronics Ltd.
Part No. 0513361410 51336-1410
Description 1.25mm (.049) Pitch Mini Mi II?/a> System Wire-to-Board IDT Housing, Single Row, 14Circuits
1.25mm (.049) Pitch Mini Mi II System Wire-to-Board IDT Housing, Single Row, 14Circuits
1.25mm (.049") Pitch Mini Mi II垄芒 System Wire-to-Board IDT Housing, Single Row, 14Circuits
MOLEX Connector

File Size 99.02K  /  2 Page

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Amphenol Communications Solutions

Part No. 98426-S04-05-133LF
Description Minitek® 2.00mm, Board to Board, Shrouded Vertical Stacking Header, Through Hole, Double Row, 10 Positions, 2.00mm (0.079in) Pitch.
Tech specs    

Official Product Page

    0513380774 51338-0774

Molex Electronics Ltd.
Part No. 0513380774 51338-0774
Description 0.40mm (.016) Pitch Board-to-Board SlimStack Receptacle, Surface Mount, DualRow, Vertical Stacking, 1.50mm (.059) Stacking Height, with Space Saving J-BendLeads, 70 Circuits, Lead-free
MOLEX Connector

File Size 509.55K  /  8 Page

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Amphenol Communications Solutions

Part No. 68655-133HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 33 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318in) Mating, 7.37 mm (0.29in) Tail.
Tech specs    

Official Product Page

    0151330203

Molex Electronics Ltd.
Part No. 0151330203
Description Pico-Clasp-to-Pico-Clasp Off-the-Shelf (OTS) Cable Assembly, Single Row,

File Size 32.97K  /  1 Page

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Amphenol Communications Solutions

Part No. 51915-133LF
Description PwrBlade®, Power Connectors, 7P 8S 1ACP 2P Right Angle Receptacle, Solder To Board
Tech specs    

Official Product Page

    0151330505

Molex Electronics Ltd.
Part No. 0151330505
Description Pico-Clasp-to-Pico-Clasp Off-the-Shelf (OTS) Cable Assembly, Single Row

File Size 37.11K  /  1 Page

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Amphenol Communications Solutions

Part No. 68705-133HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 33 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    51336-1810 0513361810

Molex Electronics Ltd.
Part No. 51336-1810 0513361810
Description 1.25mm (.049) Pitch Mini Mi II?/a> System Wire-to-Board IDT Housing, Single Row, 18Circuits
1.25mm (.049) Pitch Mini Mi II System Wire-to-Board IDT Housing, Single Row, 18Circuits

File Size 98.92K  /  2 Page

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Amphenol Communications Solutions

Part No. 98426-S04-25-133LF
Description Minitek® 2.00mm, Board to Board, Shrouded Vertical Stacking Header, Through Hole, Double Row, 50 Positions, 2.00mm (0.079in) Pitch.
Tech specs    

Official Product Page

    0759105133

Molex Electronics Ltd.
Part No. 0759105133
Description GbX I-Trac Right-Angle Header Module, 1.85mm by 3.70mm Pitch, Right Guided Inverted,

File Size 32.91K  /  2 Page

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Amphenol Communications Solutions

Part No. 77315-133-36LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 36 Positions 2.54mm (0.100in) Pitch, Right Angle
Tech specs    

Official Product Page

    0151330400

Molex Electronics Ltd.
Part No. 0151330400
Description Pico-Clasp-to-Pico-Clasp Off-the-Shelf (OTS) Cable Assembly, Single Row

File Size 35.41K  /  1 Page

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Amphenol Communications Solutions

Part No. 93235-133LF
Description Metral® Board Connectors, Backplane Connectors, 4 Row Signal Receptacle, Straight, Solder-to-Board, LF.
Tech specs    

Official Product Page

    51338-0474 0513380474

Molex Electronics Ltd.
Part No. 51338-0474 0513380474
Description 0.40mm (.016) Pitch Board-to-Board SlimStack?/a> Receptacle, Surface Mount, DualRow, Vertical Stacking, 1.50mm (.059) Stacking Height, with Space Saving J-BendLeads, 40 Circuits, Lead-free
0.40mm (.016) Pitch Board-to-Board SlimStack Receptacle, Surface Mount, DualRow, Vertical Stacking, 1.50mm (.059) Stacking Height, with Space Saving J-BendLeads, 40 Circuits, Lead-free

File Size 509.53K  /  8 Page

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Amphenol Communications Solutions

Part No. 68015-133HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 33 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

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Part: 5130
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