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  62100-5850 Datasheet PDF File

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    0621000400

Molex Electronics Ltd.
Part No. 0621000400
Description IDT Manual Handtool
File Size 38.66K  /  1 Page

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Amphenol Communications Solutions
Part No. 86585-036LF
Description MINI LATCH HSG DR .125X.-250CC
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    0885262100

Molex Electronics Ltd.
Part No. 0885262100
Description LC-to-ST, Multimode, 62.5/125μm, Simplex, 0.90mm (.035), Standard Fiber Optic Cable Assembly, 1.0m (3.28)
File Size 69.51K  /  2 Page

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Amphenol Communications Solutions
Part No. 86585-040LF
Description MINI LATCH HSG DR .125X.-250CC
Tech specs 　 　

Official Product Page

    0621002000

Molex Electronics Ltd.
Part No. 0621002000
Description IDT Ribbon Cable Module Operating Instruction for 2.0mm Milli-Grid Dual row 87568 Series
File Size 270.14K  /  4 Page

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Amphenol Communications Solutions
Part No. 86585-030LF
Description MINI LATCH HSG DR .125X.-250CC
Tech specs 　 　

Official Product Page

    RADIALL S A
Part No. R585462100
Description RF COAXIAL RELAY, DP3T, LATCHED, 0.42A (COIL), 12VDC (COIL), 5040mW (COIL), 18000MHz, PANEL MOUNT
File Size 93.19K  /  2 Page

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Amphenol Communications Solutions
Part No. 68585-006RLF
Description BergStik® 2.54mm, Board to Board connector, Vertical 2 Row Board-to-Board Stacking Header 20 Positions, 2.54mm Pitch. 0.76um (30u\\.) GXT™ Mating plating.
Tech specs 　 　

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    0621000101

Molex Electronics Ltd.
Part No. 0621000101
Description FERRULE CRIMP DIES 71256-0001 FERRULE
File Size 30.99K  /  1 Page

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Amphenol Communications Solutions
Part No. 86585-024LF
Description MINI LATCH HSG DR .125X.-250CC
Tech specs 　 　

Official Product Page

    0767621001

Molex Electronics Ltd.
Part No. 0767621001
Description 2.00mm (.079) Pitch VHDM? H Board-to-Board Backplane Header, Vertical, 6-RowGuide Pin, Shield End Module, Open End Version, 60 Circuits, Pin Length 4.75mm
File Size 397.06K  /  4 Page

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Amphenol Communications Solutions
Part No. 68585-011LF
Description BergStik® 2.54mm, Board to Board connector, Vertical 2 Row Board-to-Board Stacking Header 30 Positions, 2.54mm Pitch. 0.76um (30u\\.) GXT™ Mating plating.
Tech specs 　 　

Official Product Page

    7447462100

Wurth Elektronik GmbH & Co. KG, Germany.
Part No. 7447462100
Description WE-TI Radial Leaded Wire Wound Inductor
File Size 569.23K  /  6 Page

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Amphenol Communications Solutions
Part No. 75915-850HLF
Description Dubox® 2.54mm, Board to Board Connector,Vertical Receptacle, Through Hole, Single row , 50 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

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    7446621007

Wurth Elektronik GmbH & Co. KG, Germany.
Part No. 7446621007
Description CURRENT-COMPENSATED CHOKE WE-LF
File Size 86.48K  /  1 Page

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Amphenol Communications Solutions
Part No. 10139585-003LF
Description HPCE R/A Receptacle 8HP2LP24S
Tech specs 　 　

Official Product Page

    TSHG6210 TSHG621009

Vishay Siliconix
Part No. TSHG6210 TSHG621009
Description High Speed Infrared Emitting Diode, 850 nm, GaAlAs Double Hetero
File Size 108.30K  /  5 Page

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Amphenol Communications Solutions
Part No. 75844-158-50LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 50 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    0740621004

Molex Electronics Ltd.
Part No. 0740621004
Description 2.00mm (.079) Pitch VHDM? Board-to-Board Backplane Header, Vertical, 8-RowGuide Pin Signal Module, Shield End Version, Pin End Version, 80 Circuits, Pin Length
MOLEX Connector
File Size 507.34K  /  4 Page

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Amphenol Communications Solutions
Part No. 68585-028LF
Description BergStik® 2.54mm, Board to Board connector, Vertical 2 Row Board-to-Board Stacking Header 64 Positions, 2.54mm Pitch. 0.76um (30u\\.) GXT™ Mating plating.
Tech specs 　 　

Official Product Page

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